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首页> 外文期刊>International journal of numerical methods for heat & fluid flow >Introduce a novel configuration of microchannel and high-conductivity inserts for cooling of disc-shaped electronic components
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Introduce a novel configuration of microchannel and high-conductivity inserts for cooling of disc-shaped electronic components

机译：引进微通道和高导电刀片的新颖配置，用于冷却盘形电子元件

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Purpose - Electronic components' efficiency is the cornerstone of technology progress. The cooling process used for electronic components plays a main role in their performance. Embedded high-conductivity material and provided microchannel heat sink are two common cooling methods. The former is expensive to implement while the latter needs micro-pump, which consumes energy to circulate the flow. The aim of this study is providing a new configuration and method for improving the performance of electronic components. Design/methodology/approach - To manage these challenges and improve the cooling efficiency, a novel method named Hybrid is presented here. Each method's performance has been investigated, and the results are widely compared with others. Considering the micro-pump power, the supply of the microchannel flow and the thermal conductivity ratio (thermal conductivity ratio is defined as the ratio of thermal conductivity of high thermal conductivity material to the thermal conductivity of base solid), the maximum disk temperature of each method was evaluated and compared to others. Findings The results indicated that the Hybrid method can reduce the maximum disk temperature up to 90 per cent compared to the embedded high thermal conductivity at the same thermal conductivity ratio. Moreover, the Hybrid method further reduces the maximum disk temperature up to 75 per cent compared to the microchannel, at equivalent power consumption. Originality/value The information in this research is presented in such a way that designers can choose the desired composition, the limited amount of consumed energy and the high temperature of the component. According to the study of radial-hybrid configuration, the different ratio of microchannel and materials with a high thermal conductivity coefficient in the constant cooling volume was investigated. The goal of the investigation was to decrease the maximum temperature of a plate on constant energy consumption. This aim has been obtained in the radial-hybrid configuration.
机译：目的 - 电子元件的效率是技术进步的基石。用于电子元件的冷却过程在其性能中起主要作用。嵌入式高导率材料和提供的微通道散热片是两种常见的冷却方法。前者在后一种需要微型泵时实现昂贵，这消耗了能量循环流动。本研究的目的是提供一种新的配置和方法，用于提高电子元件的性能。设计/方法/方法 - 管理这些挑战并提高冷却效率，这里提出了一种名为Hybrid的新方法。每种方法的表现都已经调查，结果与他人相比广泛。考虑到微泵功率，微通道流量的供应和导热率比（导热比率定义为高导热率材料的导热率与基础固体导热率的导热率），每个磁盘温度评估方法并与其他方法进行比较。结果表明，与相同的导热比相同的嵌入式高导热率，混合方法可以将最大磁盘温度降低至90％。此外，与微通道相比，混合方法进一步将最高75％的最大磁盘温度降低到等效功耗。原创性/值本研究中的信息以这样的方式提出，使得设计人员可以选择所需的组合物，所需的能量有限的能量和组件的高温。根据径向 - 混合配置的研究，研究了微通道和材料的不同比率在恒定冷却体积中具有高导热系数。调查的目标是降低板块的最高温度恒定能耗。该目的已经在径向混合配置中获得。

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