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首页> 外文期刊>Japanese journal of applied physics >Piezoelectrically Driven Dispensing Head for Encapsulation of Light Emitting Diode Chip
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Piezoelectrically Driven Dispensing Head for Encapsulation of Light Emitting Diode Chip

机译：压电驱动点胶头，用于封装发光二极管芯片

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摘要

This study is about an amplified piezoelectric actuator driving a noncontact dispensing head. This dispensing head is mostly used for dispensing silicone encapsulants in a light emitting diode (LED) packaging process. The dispensing head using the piezoelectric actuator is capable of precisely dispensing high-viscosity silicone encapsulants at a high speed. However, the multilayer piezoelectric actuator has a very tiny displacement as small as the order of 10 μm. Accordingly, a device for amplifying the displacement of multilayer piezoelectric actuators is needed. To this end, the authors designed and manufactured a displacement amplification device using a metal frame. The amplification device consists of two multilayer piezoelectric actuators and a metal frame for amplifying displacement. The amplification device has a 209 μm displacement at an input DC voltage of 150 V. The extension displacement and contraction displacement generate 9 and 10 N forces, respectively.
机译：这项研究是关于驱动非接触式分配头的放大压电致动器。该分配头主要用于在发光二极管（LED）封装过程中分配有机硅密封剂。使用压电致动器的分配头能够以高速精确地分配高粘度的有机硅密封剂。然而，多层压电致动器具有非常小的位移，小至10μm的量级。因此，需要一种用于放大多层压电致动器的位移的装置。为此，作者设计并制造了使用金属框架的位移放大装置。放大装置由两个多层压电致动器和一个用于放大位移的金属框架组成。放大设备在150 V的输入直流电压下的位移为209μm。伸展位移和收缩位移分别产生9和10 N的力。

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  • 来源
    《Japanese journal of applied physics》 |2012年第9issue3期|09MD15.1-09MD15.4|共4页
  • 作者

    Young-Bog Ham; Soo-Kwan Jang; Sung-Jin Oh; Eun-Che Jeon; Jung-Ho Park; So-Nam Yun; Sang-Gyu Choi;

  • 作者单位

    Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Republic of Korea;

    Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Republic of Korea;

    Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Republic of Korea;

    Nano Convergence and Manufacturing Systems Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Republic of Korea;

    Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Republic of Korea;

    Extreme Mechanical Engineering Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Republic of Korea;

    Nano Convergence and Manufacturing Systems Research Division, Korea Institute of Machinery and Materials, Daejeon 305-343, Republic of Korea;

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