Nondestructive Warpage Measurements of LSI Chips in a Stacked System in Package by Using High-Energy X-ray Diffraction

Akio Toda; Nobuyuki Ikarashi

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Nondestructive Warpage Measurements of LSI Chips in a Stacked System in Package by Using High-Energy X-ray Diffraction

机译：使用高能X射线衍射测量堆叠式系统中LSI芯片的无损翘曲

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We describe high-energy X-ray diffraction to examine the warpage of packaged LSI chips nondestructively. Less absorption of the high-energy X-rays enables us to observe diffracted X-rays through packaging materials and LSI chips. We demonstrate that it is possible to measure the warpage of LSI chips in a stacked system in package (SiP). Although an LSI chip in a single-chip ball grid array (BGA) package simply warps into a convex-down shape, the LSI chips packaged in the BGA package as a stacked SiP warp into the shape of waves. It is inferred from results of our examination that the stress due to a printed circuit board substrate and molding resin affects chip warpage.

机译：我们描述了高能X射线衍射，以无损地检查封装的LSI芯片的翘曲。高能X射线的吸收较少，使我们能够观察到通过包装材料和LSI芯片产生的衍射X射线。我们证明了有可能在堆叠的系统级封装（SiP）中测量LSI芯片的翘曲。尽管单芯片球栅阵列（BGA）封装中的LSI芯片简单地翘曲成向下凸的形状，但作为堆叠式SiP封装在BGA封装中的LSI芯片却翘曲成波状。从我们的检查结果可以推断出，由于印刷电路板基板和模塑树脂引起的应力会影响芯片翘曲。

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《Japanese journal of applied physics》 |2010年第4issue2期|P.04DB03.1-04DB03.5|共5页
作者
Akio Toda; Nobuyuki Ikarashi;
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Device Platforms Research Laboratories, NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1189, Japan;

Device Platforms Research Laboratories, NEC Corporation, 1120 Shimokuzawa, Sagamihara, Kanagawa 229-1189, Japan;

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2. Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages [J] . A. Bose, R. K. Vijayaraghavan, A. Cowley, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2016,第4期

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3. Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages [J] . Jae-Won Jang Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2012,第5期

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5. Alloy Development and High-Energy X-Ray Diffraction Studies of NiTiZr and NiTiHf High Temperature Shape Memory Alloys [D] . Carl, Matthew A. 2018

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6. Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages [O] . B. K. Tanner, A. N. Danilewsky, R. K. Vijayaraghavan, -1

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8. Optically Guiding Substrates for Low Cost Optical Interconnects in Stacked Multichip Module and Chip Scale Packaging [R] . Haas, F. , Cook, P. 1998

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Nondestructive Warpage Measurements of LSI Chips in a Stacked System in Package by Using High-Energy X-ray Diffraction

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