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首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >A New Cerium-Based Ternary Oxide Slurry, CeTi_2O_6, for Chemical-Mechanical Polishing
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A New Cerium-Based Ternary Oxide Slurry, CeTi_2O_6, for Chemical-Mechanical Polishing

机译:一种用于化学机械抛光的新型铈基三元氧化物浆料CeTi_2O_6

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摘要

A new ternary oxide slurry, CeTi_2O_6 containing Ce~(4+) ions, was found to be effective as an abrasive in chemical-mechanical polishing (CMP). The ternary oxide was synthesized by the Pechini polymerizable complex (PC) method. X-ray diffraction (XRD) Rietveld analysis indicated that the oxide possesses a single CeTi_2O_6 phase of a brannerite structure (C2/m, No. 12). When CeTi_2O_6 was used as an abrasive slurry for polishing thin oxide film, the removal rate was as high as that of ceria (CeO_2) slurry.
机译:发现一种新的三元氧化物浆料,含有Ce〜(4+)离子的CeTi_2O_6,可以有效地用作化学机械抛光(CMP)的研磨剂。三元氧化物是通过Pechini可聚合配合物(PC)方法合成的。 X射线衍射(XRD)Rietveld分析表明,该氧化物具有褐铁矿结构的单一CeTi_2O_6相(C2 / m,No。12)。当将CeTi_2O_6用作抛光薄氧化膜的研磨浆时,其去除率与二氧化铈(CeO_2)浆一样高。

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