Thermal Flow and Chemical Shrink Techniques for Sub-100 nm Contact Hole Fabrication in Electron Beam Lithography

Tsung-Lung Li; Jyh-Hua Ting

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Thermal Flow and Chemical Shrink Techniques for Sub-100 nm Contact Hole Fabrication in Electron Beam Lithography

机译：电子束光刻中低于100 nm接触孔制造的热流和化学收缩技术

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摘要

It is shown by physical arguments and simulations that the data reported in the original article for 360 nm contact holes should have been for initial contact hole opening of approximately 300 nm; in other words, the 360 nm contact holes are actually 300 nm ones.

机译：通过物理论证和模拟表明，原始文章中报告的360 nm接触孔的数据应为大约300 nm的初始接触孔开口；换句话说，360 nm的接触孔实际上是300 nm的接触孔。

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《Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers》 |2006年第8a期|p.6539|共1页
作者
Tsung-Lung Li; Jyh-Hua Ting;
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Department of Applied Physics, National Chia-Yi University, 300 Hsueh-Fu Road, Chiayi 60004, Taiwan, R.O.C.;

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正文语种 eng
中图分类应用物理学;
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2. Thermal-flow techniques for sub-35 nm contact-hole fabrication in electron-beam lithography [J] . H. L. Chen, C. H. Chen, F. H. Ko, Journal of Vacuum Science & Technology. B, Microelectronics Processing and Phenomena . 2002,第6期

机译：电子束光刻中低于35 nm接触孔制造的热流技术
3. Fabrication of sub-100 nm patterns in SiO2 templates by electron-beam lithography for the growth of periodic III-V semiconductor nanostructures [J] . Chen A, Chua SJ, Chen P, Nanotechnology . 2006,第15期

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4. Thermal flow and chemical shrink techniques for sub-100 nm contact hole fabrication in electron beam lithography [C] . Chen, H.L., Ko, . 2001

机译：电子束光刻中低于100 nm接触孔制造的热流和化学收缩技术
5. Fabrication and characterization of nanoelectronic devices for electron beam lithography applications. [D] . Yang, Xiaojing. 2005

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6. Use of Sacrificial Nanoparticles to Remove the Effects of Shot-noisein Contact Holes Fabricated by E-beam Lithography [O] . Shankar B. Rananavare, Moshood K. Morakinyo 2017

机译：使用牺牲性纳米颗粒消除散粒噪声的影响电子束光刻制造的接触孔中的孔
7. High contrast 3D proximity correction for electron-beam lithography: An enabling technique for the fabrication of suspended masks for complete device fabrication within an UHV environment [O] . Rosamond MC, Batley J, Burnell G, 2015

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Thermal Flow and Chemical Shrink Techniques for Sub-100 nm Contact Hole Fabrication in Electron Beam Lithography

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