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Another dimension in integrated circuit trust

机译：集成电路信任的另一个方面

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摘要

Although 3D integrated circuit technology has typically been used to solve specific design goals, it has great potential for protecting intellectual property from theft or unwanted modification while at a third-party fabrication facility. We present analysis of a technique for splitting a design across multiple die layers for this purpose. From the perspective of a third-party, this technique effectively encrypts the circuit, preventing unauthorized use of, or alteration to, the design. The device is “unencrypted” at a secure final assembly location where it is oriented and bonded according to its secret key. As is true for any cryptographic technique, analysis of the algorithm or implementation may result in attacks with lower combinatorial complexity. We look at some of these potential attacks and discuss a number of possible solutions. Finally, we introduce the inter-die routing layer, which effectively complements the 3D splitting technique, making it much more difficult to develop attacks to bypass a brute force approach.
机译：尽管3D集成电路技术通常用于解决特定的设计目标，但在第三方制造工厂中，它具有保护知识产权免遭盗窃或不必要修改的巨大潜力。为此，我们介绍了一种用于在多个管芯层之间拆分设计的技术的分析。从第三方的角度来看，该技术有效地加密了电路，从而防止了设计的未经授权的使用或更改。该设备在安全的最终组装位置被“未加密”，在该位置根据其秘密密钥进行定向和绑定。就像任何密码技术一样，对算法或实现的分析可能会导致组合复杂度较低的攻击。我们研究了其中一些潜在的攻击，并讨论了许多可能的解决方案。最后，我们引入了芯片间路由层，该层有效地补充了3D拆分技术，使开发绕过蛮力方法的攻击变得更加困难。

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