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首页> 外文期刊>Journal of Electronic Materials >Effects of Palladium and Solder Aging on Mechanical and Fatigue Properties of Tin-Lead Eutectic Solder
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Effects of Palladium and Solder Aging on Mechanical and Fatigue Properties of Tin-Lead Eutectic Solder

机译：钯和焊料时效对锡铅共晶焊料力学和疲劳性能的影响

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摘要

The effects of (a) 0.5 wt./100 of Pd addition, and (b) aging on mechanical and fatigue properties of eutectic solder (63Sn37Pb) were investigated. The creep rate of eutectic solder at room temperature is not affected by Pd addition. However, at 80"C, solder containing Pd creeps slower than Sn-Pb eutectic. Strain rate dramatically affects yield and tensile stress of eutectic solder with Pd as it does for the binary solder. Isothermal fatig'Ue life of solder at 25℃ is essentially not changed by Pd addition. The microstructure of Pd-containing solder consisted of polyhedral grains of (Pb), (Sn), and a dispersion of PdSn. intermetallic. Signifi- cant microstructural changes and interphase interface phenomena take place during creep deformation at 25 and 80℃. Atnbient aging for seven years leads to solder softening and to moderate increase in isothermal fatigue life.
机译：研究了（a）添加0.5 wt./100 Pd和（b）时效对共晶焊料（63Sn37Pb）的机械和疲劳性能的影响。室温下共晶焊料的蠕变速率不受Pd添加的影响。但是，在80“ C时，含Pd的焊料蠕变慢于Sn-Pb共晶。应变速率显着影响含Pd的共晶焊料的屈服强度和拉伸应力，这与二元焊料一样。等温于25°C的焊料的寿命为含Pd焊料的微观结构由（Pb），（Sn）的多面体晶粒和PdSn。金属间化合物的分散组成，在蠕变时会发生明显的微观结构变化和相间界面现象。在25和80℃的温度下老化7年会导致焊料软化并适度增加等温疲劳寿命。

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