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首页> 外文期刊>Journal of Heat Transfer >Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced MicroChannel
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Pool Boiling Heat Transfer and Bubble Dynamics Over Plain and Enhanced MicroChannel

机译：普通和增强型微通道上的池沸腾传热和气泡动力学

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摘要

Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. It was determined that surface modifications to silicon chips can improve the heat transfer coefficient by a factor up to 3.4 times the performance of a plain chip. Surfaces with microchannels have shown to be efficient for boiling heat transfer by allowing liquid to flow through the open channels and wet the heat transfer surface while vapor is generated. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications.
机译：池沸腾在高热通量应用中是令人关注的，因为它具有去除大量潜热的潜能，而蒸发潜热又有很大的压降损失，使冷却剂循环流经系统。但是，池沸腾系统的传热性能不足以匹配由在单相条件下运行的增强型微通道提供的冷却能力。这项工作的目的是评估在硅芯片上蚀刻的结构化表面特征的熔池沸腾性能。相对于普通芯片的性能被标准化。这项研究还着重于在各种热通量下的平整和结构化微通道表面上的气泡动力学，以了解潜在的传热机理。已确定对硅芯片进行表面改性可以将传热系数提高至普通芯片性能的3.4倍。具有微通道的表面已经显示出通过允许液体流过开放通道并在产生蒸汽的同时润湿传热表面，从而有效地沸腾了传热。预期这项工作将导致改进的增强功能，以扩展池沸腾选项，以满足电子冷却应用中对高热通量的去除需求。

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