...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Materials Research >A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line
【24h】

A diffusion-viscous analysis and experimental verification of defect formation in sintered silver bond-line

机译：烧结银键合线中缺陷形成的扩散黏性分析和实验验证

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The low-temperature joining technique (LTJT) by silver sintering is being implemented by major manufacturers of power electronic devices and modules for bonding power semiconductor chips. A common die-attach material used with LTJT is a silver paste consisting of silver powder (micrometer- or nanometer-sized particles) mixed in organic solvent and binder formulation. It is believed that the drying of the paste during the bonding process plays a critical role in determining the quality of the sintered bond-line. In this study, a model based on the diffusion of solvent molecules and viscous mechanics of the paste was introduced to determine the stress and strain states of the silver bond-line. A numerical simulation algorithm of the model was developed and coded in the C+ + programming language. The numerical simulation allows determination of the time-dependent physical properties of the silver bond-line as the paste is being dried with a heating profile. The properties studied were solvent concentration, weight loss, shrinkage, stress, and strain. The stress is the cause of cracks in the bond-line and bond-line delamination. The simulated results were verified by experiments in which the formation of bond-line cracks and interface delamination was observed during the pressure-free drying of a die-attach nanosilver paste. The simulated results were consistent with our earlier experimental findings that the use of uniaxial pressure of a few mega-Pascals during the drying stage of a nanosilver paste was sufficient to produce high-quality sintered joints. The insight offered by this modeling study can be used to develop new paste formulations that enable pressure-free, low-temperature sintering of the die-attach material to significantly lower the cost of implementing the LTJT in manufacturing.
机译：主要的电力电子设备制造商和用于粘接功率半导体芯片的模块正在实施通过银烧结的低温接合技术（LTJT）。与LTJT一起使用的一种常见的芯片连接材料是一种银浆，它由混合在有机溶剂和粘合剂配方中的银粉（微米或纳米级颗粒）组成。可以相信，在粘结过程中糊的干燥在确定烧结粘结线的质量方面起着至关重要的作用。在这项研究中，引入了基于溶剂分子的扩散和浆料的粘性力学的模型来确定银键合线的应力和应变状态。开发了该模型的数值模拟算法，并使用C ++编程语言进行了编码。数值模拟可以确定糊状物随加热曲线干燥时随时间变化的物理特性。研究的性能为溶剂浓度，重量减轻，收缩率，应力和应变。应力是粘结线和粘结线分层破裂的原因。通过实验验证了模拟结果，其中在无压干燥贴片纳米银浆的过程中观察到粘结线裂纹的形成和界面分层。模拟结果与我们先前的实验发现一致，即在纳米银浆的干燥阶段使用几兆帕的单轴压力足以产生高质量的烧结接头。该建模研究提供的见解可用于开发新的浆料配方，从而使压模连接材料能够进行无压力，低温烧结，从而显着降低在制造中实施LTJT的成本。

著录项

  • 来源
    《Journal of Materials Research》 |2014年第8期|1006-1017|共12页
  • 作者

    Kewei Xiao; Khai D.T. Ngo; Guo-Quan Lu;

  • 作者单位

    Center for Power Electronics Systems, Virginia Tech, Blacksburg, Virginia 24061 and Department of Materials Science and Engineering, Virginia Tech, Blacksburg, Virginia 24061;

    Center for Power Electronics Systems, Virginia Tech, Blacksburg, Virginia 24061and The Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, Virginia 24061;

    Center for Power Electronics Systems, Virginia Tech, Blacksburg, Virginia 24061 Department of Materials Science and Engineering, Virginia Tech, Blacksburg, Virginia 24061 and The Bradley Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, Virginia 24061;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号