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首页> 外文期刊>Journal of Materials Research >Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 deg C
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Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 deg C

机译：Sn-Ag-Cu球栅阵列封装的Sn-Zn-Bi添加在240℃下的电阻

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摘要

Sn-8Zn-3Bi solder paste and Sn-3.2Ag-0.5Cu solder balls were reflowed simultaneously at 240 deg C on Cu/Ni/Au metallized ball grid array substrates. The joints without Sn-Zn-Bi addition (only Sn-Ag-Cu) were studied as a control system. Electrical resistance was measured after multiple reflows and aging. The electrical resistance of the joint (R_1) consisted of three parts: the solder bulk (R_(solder) bulk, upper solder highly beyond the mask), interfacial solder/intermetallic compound (R_(solder bulk), and the substrate (R_(substrate). R_1 increased with reflows and aging time. R_(solder/IMC) rather than R_(solder/IMC) and R_(substrate), seemed to increase with reflows and aging time. The increase of R1 was ascribed to the R_(solder/IMC) rises. R_(substrate) was the major contribution to R_1. However R_(solder/IMC) dominated the increase of R1 with reflows and aging. R1 of Sn-Zn-Bi /Sn-Ag-Cu samples were higher than that of Sn-Ag-Cu samples in various tests.
机译：Sn-8Zn-3Bi锡膏和Sn-3.2Ag-0.5Cu锡球在240℃同时在Cu / Ni / Au金属化球栅阵列基板上回流。研究了不添加Sn-Zn-Bi（仅Sn-Ag-Cu）的接头作为控制系统。在多次回流和老化之后测量电阻。接头的电阻（R_1）由三部分组成：焊料块（R_（焊料）块，上层焊料高度超出掩模），界面焊料/金属间化合物（R_（焊料块）和基板（R_（ R_1随着回流和老化时间的增加而增加。R_（焊料/ IMC）而非R_（焊料/ IMC）和R_（衬底）似乎随着回流和老化时间的增加而增加。R1的增加归因于R_（焊锡/ IMC）上升.R_（基体）是对R_1的主要贡献，但是R_（焊锡/ IMC）随回流焊和时效的增加而支配R1的增加。比各种测试中的Sn-Ag-Cu样品要高。

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  • 来源
    《Journal of Materials Research》 |2007年第1期|p.113-123|共11页
  • 作者

    Po-Cheng Shih; Kwang-Lung Lin;

  • 作者单位

    Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan 701, Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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