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首页> 外文期刊>Journal of Materials Research >Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
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Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

机译：凸点金属化条件下不同厚度的电镀Ni / Cu的Sn-3.5Ag焊料的冶金反应

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摘要

Nickel has been widely used as an under-bump metallization (UBM) material in the microelectronics industry. The solid-state reaction between the eutectic SnAg solder bumps and three thicknesses of Ni/Cu UBM was investigated, with 5 mu m-Cu/3mu m -Ni, 3 mu m-Cu/2 mu m-Ni, and 0 mu m-Cu/1 mu m-Ni. It was found that the shear strength of the solder bumps decreased after the solid-state aging at 150 deg C for 200 h, and it did not change much after it was prolonged for 500 and 1000 h. Aging of the Ag_3Sn intermetallic compound (IMC) and grain growth of the solder are responsible for the decrease in the shear strength. Furthermore, the shear test results indicated that the fracture mode switched from ductile to brittle for the solder bumps with 1 mu m Ni after J aging longer than 200 h, causing the strength of the solder to decrease abruptly. This is attributed to the consumption of the peripheral Ni layer after the solid-state aging for 1000 h. The Ni consumption rate was measured to be 0.02 mu m/h~(1/2) at 150 deg C.
机译：镍已在微电子工业中广泛用作凸块下金属化（UBM）材料。研究了5μm-Cu/3μm-Ni，3μm-Cu/2μm-Ni和0μm的共晶SnAg焊料凸块与三种厚度的Ni / Cu UBM之间的固态反应。 -Cu / 1微米m-Ni。发现在150℃下固态老化200h后，焊料凸块的剪切强度降低，而在延长500和1000h后，其剪切强度变化不大。 Ag_3Sn金属间化合物（IMC）的时效和焊料的晶粒长大是导致剪切强度降低的原因。此外，剪切试验结果表明，当J老化200 h以上后，Ni含量为1μm的焊料凸点的断裂模式从延性转变为脆性，导致焊料强度突然降低。这归因于固态老化1000小时后周边Ni层的消耗。在150℃下测得的Ni消耗速率为0.02μm/ h〜（1/2）。

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  • 来源
    《Journal of Materials Research》 |2005年第10期|p.2772-2779|共8页
  • 作者

    Chang Pin Huang; Chin Chen; C.Y. Liu;

  • 作者单位

    Department of Material Science and Engineering, National Chiao Tung University, Hsinchu 30050, Taiwan, Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
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