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首页> 外文期刊>Journal of Materials Research >Indentation mechanics of Cu-Be quantified by an in situ transmission electron microscopy mechanical probe
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Indentation mechanics of Cu-Be quantified by an in situ transmission electron microscopy mechanical probe

机译：用原位透射电子显微镜机械探针定量Cu-Be的压痕力学

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摘要

In situ transmission electron microscopy was used to study, in real time, the sub-surface deformation taking place in Cu-Be alloy during nanoindentation. A twinned region of the material was indented with a sharp tungsten tip in a specially developed transmission electron microscopy (TEM) holder. A flexible hinge-based force sensor was used to measure the force on the indenter, and the force-displacement curve for the tip was obtained by tracking the tip in the sequential images of a TEM video of the indentation process. Step-like structures -50 nm in size resulting from thetip surface roughness were observed to generate clusters of dislocations in the sample when they come in contact with the softer Cu-Be. With this setup, the forces and the mean pressure associated with such an individual deformation event in a nanostructured TEM sample were measured.
机译：原位透射电子显微镜用于实时研究纳米压痕过程中Cu-Be合金的亚表面变形。在专门开发的透射电子显微镜（TEM）固定器中，材料的孪生区域带有尖锐的钨尖，使其凹入。使用基于柔性铰链的力传感器测量压头上的力，并通过在压痕过程的TEM视频的连续图像中跟踪尖端来获得尖端的力-位移曲线。观察到由尖端表面粗糙度导致的大小为-50 nm的阶梯状结构，当它们与较软的Cu-Be接触时会在样品中产生位错簇。通过这种设置，测量了纳米结构TEM样品中与此类单个变形事件相关的力和平均压力。

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  • 来源
    《Journal of Materials Research》 |2005年第10期|p.2726-2732|共7页
  • 作者

    M.S. Bobji; J.B. Pethica; B.J. Inkson;

  • 作者单位

    Department of Mechanical Engineering, Indian Institute of Science, Bangalore, 560 012 India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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