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首页> 外文期刊>Journal of Materials Research >Mechanical stress, grain-boundary relaxation, and oxidation of sputtered CuNi(Mn) films
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Mechanical stress, grain-boundary relaxation, and oxidation of sputtered CuNi(Mn) films

机译:溅射CuNi(Mn)薄膜的机械应力,晶界弛豫和氧化

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This paper focuses on understanding stress development in CuNi42Mnl thin films during annealing in Ar. In addition to stress-temperature measurements, resistance-temperature investigations and chemical and microstructural characterization by Auger electron spectroscopy, scanning and transmission electron microscopy, x-ray diffraction, and atomic force microscopy were also carried out. The films are polycrystalline with a grain size of 20 nm up to 450 deg C. To explain the stress evolution above l20 deg C, atomic rearrangement (excess-vacancy annihilation, grain-boundary relaxation, and shrinkage of grain-boundary voids) and oxidation were considered. Grain-boundary relaxation was found to be the dominating process up to 250-300 deg C. A sharp transition from compressive to tensile stress between 300 and 380 deg C is explained by the formation of a NiO surface layer due to reaction with the remaining oxygen in the Ar atmosphere. This oxidation is masking the inherent structural relaxation above 300 deg C.
机译:本文着重了解在Ar退火过程中CuNi42Mnl薄膜的应力发展。除了进行应力温度测量外,还进行了电阻温度研究以及俄歇电子能谱,扫描和透射电子显微镜,x射线衍射和原子力显微镜的化学和微结构表征。薄膜是多晶的,在450摄氏度以下的晶粒尺寸为20 nm。为解释在120摄氏度以上的应力演变,原子重排(过量空位an灭,晶界弛豫和晶界空隙收缩)和氧化被认为是。发现晶界弛豫是直至250-300摄氏度的主要过程。在300到380摄氏度之间,从压应力到拉应力的急剧转变是由于与其余氧气反应而形成的NiO表面层所解释的。在Ar气氛中。这种氧化掩盖了高于300摄氏度时固有的结构松弛。

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