Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

K. L. Chan; M. Mariatti; Z. Lockman; L. C. Sim

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Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

机译：超声介质对导电胶（ECA）应用铜纳米粒子填充环氧复合材料性能的影响

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In this study, the relationship of three different media, (air, epoxy fluid, and chloroform solution) on the electrical, mechanical, and thermal properties of 5 vol.% copper nanoparticle (CuNP)-filled epoxy nanocomposite was investigated. Microscopic observation revealed that the CuNP ultrasonicated with chloroform solution exhibited the best filler distribution in the epoxy matrix. It showed high electrical conductivity of 7.65 × 10~(-3) S cm~(-1) and flexural properties, and low coefficient of thermal expansion (CTE) compared with the other two nanocomposites. However, CuNP prepared by chloroform medium showed inferior thermal property compared with the other two nanocomposites according to thermogravimetric analysis (TGA).

机译：在这项研究中，研究了三种不同的介质（空气，环氧流体和氯仿溶液）与填充5体积％铜纳米颗粒（CuNP）的环氧纳米复合材料的电，机械和热性能之间的关系。显微镜观察表明，用氯仿溶液超声处理的CuNP在环氧树脂基质中表现出最佳的填料分布。与其他两种纳米复合材料相比，它具有7.65×10〜（-3）S cm〜（-1）的高电导率和挠曲性能，并且热膨胀系数（CTE）低。然而，根据热重分析（TGA），用氯仿介质制备的CuNP与其他两种纳米复合材料相比，热性能较差。

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《Journal of materials science》 |2010年第8期|P.772-778|共7页
作者
K. L. Chan; M. Mariatti; Z. Lockman; L. C. Sim;
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作者单位

School of Material and Mineral Resources Engineering, University Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;

rnSchool of Material and Mineral Resources Engineering, University Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;

rnSchool of Material and Mineral Resources Engineering, University Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia;

rnIntel Technology (M) Sdn. Bhd, Penang, Malaysia;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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正文语种 eng
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1. Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application [J] . K. L. Chan, M. Mariatti, Z. Lockman, Journal of Materials Science: Materials in Electronics . 2010,第8期

机译：超声介质对导电胶（ECA）应用铜纳米粒子填充环氧复合材料性能的影响
2. Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs) [J] . Yumi Kwon, Byung-seung Yim, Jong-min Kim, Microelectronics reliability . 2011,第4期

机译：官能化碳纳米管在导电胶（ECA）的环氧复合材料中的分散，混合互连和散热特性
3. Preparation and properties of amine functionalized graphene filled epoxy thin film nano composites for electrically conductive adhesive [J] . Z. A. Ghaleb, M. Mariatti, Z. M. Ariff, Journal of materials science . 2018,第4期

机译：胺功能化石墨烯填充环氧树脂薄膜纳米复合材料的制备及性能
4. Study on the Electrical Property of Silver (Ag) Nanoparticles Filled Epoxy Composites for the Application of Electrically Conductive Adhesives (ECAs) in Electronic Packaging [C] . D. I. Tee, M. Mariatti, C. H. See, International Conference on Electronics Manufacturing and Technology . 2006

机译：银（Ag）纳米粒子填充环氧复合材料在电子包装中施加导电粘合剂（ECAS）的电性能研究
5. High performance electrically conductive adhesives (ECAs) for leadfree interconnects. [D] . Li, Yi. 2007

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机译：二次碳纳米填料对基于环氧树脂和石墨的导电杂化复合材料电热和力学性能的影响
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Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

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