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Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

机译:Sn-Cu无铅焊料合金的组织和拉伸性能研究

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In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry, the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this work, microstructures and mechanical properties of the lead-free solder alloy Sn99.3Cu0.7(Ni) are investigated. This paper will compare the mechanical properties of the lead-based with lead-free solder alloys (Sn99.3Cu0.7(Ni) and 63Sn37Pb). The tensile tests of lead-based and lead-free solder alloys (Sn99.3Cu0.7(Ni) and Sn63Pb37) were conducted at room and elevated temperature at constant strain rate; the relevant tensile properties of Sn99.3Cu0.7(Ni) and Sn63Pb37 were obtained. Specifically, the tensile strength of this lead-free solder- Sn99.3Cu0.7(Ni) in 25 degrees C, 50 degrees C, 75 degrees C, 100 degrees C, 125 degrees C was investigated; and it was found that tensile strength of the lead-free solder decreased with the increasing test temperature at constant strain rate, showing strong temperature dependence. The lead-free solder alloy Sn99.3Cu0.7(Ni) was found to have favorable mechanical properties and it may be able to replace the lead-based solder alloy such as Sn63Pb37 in the packaging processes in microelectronic industry.
机译:近年来,微电子器件中铅和含铅化合物对环境的污染引起了学术界和工业界的越来越多的关注,无铅焊料合金在一些包装过程中开始替代铅基焊料。设备和组件。在这项工作中,研究了无铅焊料合金Sn99.3Cu0.7(Ni)的组织和力学性能。本文将比较铅基和无铅焊料合金(Sn99.3Cu0.7(Ni)和63Sn37Pb)的机械性能。铅基和无铅焊料合金(Sn99.3Cu0.7(Ni)和Sn63Pb37)的拉伸试验是在室温和恒定应变速率下进行的。得到了Sn99.3Cu0.7(Ni)和Sn63Pb37的相关拉伸性能。具体而言,研究了该无铅焊料Sn99.3Cu0.7(Ni)在25℃,50℃,75℃,100℃,125℃下的拉伸强度。并且发现在恒定应变速率下,无铅焊料的拉伸强度随测试温度的升高而降低,表现出很强的温度依赖性。发现无铅焊料合金Sn99.3Cu0.7(Ni)具有良好的机械性能,并且可以在微电子工业的包装过程中替代Sn63Pb37等铅基焊料合金。

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