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首页> 外文期刊>Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe >The bulk alloy microstructure and tensile properties of Sn-lAg-0.5Cu-xAl lead-free solder alloys (x= 0, 1, 1.5 and 2 wt.%)
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The bulk alloy microstructure and tensile properties of Sn-lAg-0.5Cu-xAl lead-free solder alloys (x= 0, 1, 1.5 and 2 wt.%)

机译：Sn-1Ag-0.5Cu-xAl无铅焊料合金的整体合金显微组织和拉伸性能（x = 0、1、1.5和2 wt。％）

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Purpose – The purpose of this paper is to investigate the effect of Al addition on the bulk alloy microstructure and tensile properties of the low Ag-content Sn-1 Ag-0.5Cu (SAC105) solder alloy. Design/methodology/approach – The Sn-1 Ag-0.5Cu-xAl (x = 0, 1, 1.5 and 2 wt.%) bulk solder specimens with flat dog-bone shape were used for tensile testing in this work. The specimens were prepared by melting purity ingots of Sn, Ag, Cu and Al in an induction furnace. Subsequently, the molten alloys were poured into pre-heated stainless steel molds, and the molds were naturally air-cooled to room temperature. Finally, the molds were disassembled, and the dog-bone samples were removed. The solder specimens were subjected to tensile testing on an INSTRON tester with loading rate 10~(-3) s~(–1). The microstructural analysis was carried out using scanning electron microscopy/Energy dispersive X-ray spectroscopy. Electron Backscatter Diffraction (EBSD) analysis was used to identify the IMC phases. To obtain the microstructure, the solder samples were prepared by dicing, molding, grinding and polishing processes. Findings – The addition of Al to the SAC105 solder alloy suppresses the formation of Ag_3Sn and Cu_6Sn_5 IMC particles and leads to the formation of larger Al-rich and Al-Cu IMC particles and a large amount of fine Al-Ag IMC particles. The addition of Al also leads to refining of the primary Sn grains. The addition of Al results in a significant increase on the elastic modulus and yield strength. On the other hand, the addition of Al drastically deteriorates the total elongation. Originality/value – The addition of Al to the low Ag-content SAC105 solderalloy has been discussed for the first time. This work provides a starting-point to study the effect of Al addition on the drop impact and thermal cycling reliability of the SAC105 alloy.
机译：目的–本文的目的是研究铝的添加对低Ag含量的Sn-1 Ag-0.5Cu（SAC105）焊料合金的整体合金组织和拉伸性能的影响。设计/方法/方法–将扁狗骨形状的Sn-1 Ag-0.5Cu-xAl（x = 0、1、1.5和2 wt。％）块状焊料样品用于拉伸测试。通过在感应炉中熔化纯锡，银，铜和铝锭来制备样品。随后，将熔融合金倒入预热的不锈钢模具中，然后将模具自然风冷至室温。最后，拆卸模具，并取出狗骨样品。焊料样品在INSTRON测试仪上以10〜（-3）s〜（-1）的加载速率进行拉伸测试。使用扫描电子显微镜/能量色散X射线光谱法进行显微结构分析。电子背散射衍射（EBSD）分析用于识别IMC相。为了获得微结构，通过切割，模制，研磨和抛光工艺制备了焊料样品。发现–向SAC105焊料合金中添加Al抑制了Ag_3Sn和Cu_6Sn_5 IMC颗粒的形成，并导致形成了较大的富Al和Al-Cu IMC颗粒，以及大量的细Al-Ag IMC颗粒。 Al的添加还导致初级Sn晶粒的细化。 Al的添加导致弹性模量和屈服强度显着增加。另一方面，Al的添加大大降低了总伸长率。原创性/价值–首次讨论了向低Ag含量的SAC105锡合金中添加Al。这项工作为研究添加Al对SAC105合金的滴落冲击和热循环可靠性的影响提供了起点。

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