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Electrical characterization of semiconductor materials and devices - review

机译:半导体材料和器件的电气特性-评论

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Semiconductor materials and devices continue to occupy a pre-eminent technological position because of their importance in building integrated electronic systems for wide ranging applications from computers, cell-phones, personal digital assistants, digital cameras and electronic entertainment systems, to electronic instrumentation for medical diagnostics and environmental monitoring. A key ingredient of this technological dominance has been the rapid advances in the quality and processing of materials-semiconductors, conductors and insulators-thus providing the complementary metal-oxide-semiconductor device technology with its important characteristics of negligible standby power dissipation, good input-output isolation, surface potential control and reliable operation. However, in assessing the material quality and device reliability, it is important to have non-destructive, accurate and easy-to-use electrical characterization techniques available, so that important parameters such as carrier doping density, type and mobility of carriers, interface quality, oxide trap density, semiconductor bulk defect density, contact and other parasitic resistances and oxide electrical integrity can be rapidly determined. This article describes some of the more widely used and popular techniques that are used to determine these important parameters. The techniques presented in this paper range in complexity and requirements for test structures. It ranges from the simple current-voltage measurements, to the more sophisticated low-frequency noise and deep-level transient spectroscopy techniques.
机译:半导体材料和器件在建立集成电子系统以从计算机,手机,个人数字助理,数码相机和电子娱乐系统到医疗诊断用电子仪器等广泛应用中的重要性方面,继续占据着领先的技术地位。和环境监测。这种技术优势的关键因素在于材料(半导体,导体和绝缘子)的质量和加工的快速进步,从而提供了互补的金属氧化物半导体器件技术,其重要特征是可忽略的待机功耗,良好的输入,输出隔离,表面电势控制和可靠的操作。但是,在评估材料质量和设备可靠性时,重要的是要提供无损,准确和易于使用的电特性鉴定技术,以便获得重要的参数,例如载流子掺杂密度,载流子类型和迁移率,界面质量可以快速确定氧化物陷阱密度,半导体体缺陷密度,接触和其他寄生电阻以及氧化物电完整性。本文介绍了用于确定这些重要参数的一些更广泛使用和流行的技术。本文介绍的技术涉及复杂性和对测试结构的要求。它的范围从简单的电流电压测量到更复杂的低频噪声和深层瞬态光谱技术。

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