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首页> 外文期刊>Journal of Materials Science >Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste
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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

机译：Sn-Ag-Cu锡膏与Sn-Zn-Bi锡膏结合后界面微观结构与剪切行为的相关性

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摘要

Sn–8Zn–3Bi solder paste was applied as a medium to joint Sn–3.2Ag–0.5Cu solder balls and Cu/Ni/Au metallized ball grid array substrates at 210 °C. Sn–Ag–Cu joints without Sn–Zn–Bi addition were also conducted for comparison. The shear behavior of the specimens was investigated after multiple reflow and thermal aging. For each strength test, more than 40 solder balls were sheared. The shear strength of Sn–Ag–Cu specimens kept constant ranging from 15.5 ± 1.3 N (single reflow) to 16.2 ± 1.0 N (ten reflows) and the fractures occurred in the solder. Shear strength of Sn–Ag–Cu/Sn–Zn–Bi specimens fell from 15.9 ± 1.7 N (single reflow) to 13.4 ± 1.6 N (ten reflows). After single reflow, Sn–Ag–Cu/Sn–Zn–Bi specimens fractured in the solder along Ag–Au–Cu–Zn intermetallic compounds and at Ni metallization. After ten reflows, fractures occurred in the solder and at solder/Ni–Sn–Cu–Zn intermetallic compound interface. The shear strengths of the Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi packages changed little after aging at 150 °C. Sn–Ag–Cu/Sn–Zn–Bi joints kept higher strength than Sn–Ag–Cu joints. Sn–Ag–Cu joints fractured in the solder after aging. But the fractures of Sn–Ag–Cu/Sn–Zn–Bi specimens shifted to the solder with aging time.
机译：在210°C的温度下，将Sn-8Zn-3Bi焊膏作为媒介来连接Sn-3.2Ag-0.5Cu焊球和Cu / Ni / Au金属化球栅阵列基板。还进行了不添加Sn-Zn-Bi的Sn-Ag-Cu接头的比较。在多次回流和热老化之后，研究了样品的剪切行为。对于每个强度测试，剪切超过40个焊球。 Sn-Ag-Cu试样的剪切强度保持恒定，范围从15.5±1.3 N（单次回流焊）到16.2±1.0 N（十次回流焊），并且在焊料中发生断裂。 Sn-Ag-Cu / Sn-Zn-Bi试样的剪切强度从15.9±1.7 N（单次回流）降至13.4±1.6 N（十次回流）。单次回流后，锡-银-铜/锡-锌-铋样品在焊料中沿着银-金-铜-锌金属间化合物和镍金属化而破裂。十次回流后，焊料中以及焊料/ Ni-Sn-Cu-Zn金属间化合物界面处发生断裂。在150°C时效后，Sn–Ag–Cu和Sn–Ag–Cu / Sn–Zn–Bi封装的剪切强度几乎没有变化。 Sn-Ag-Cu / Sn-Zn-Bi接头的强度高于Sn-Ag-Cu接头。老化后焊料中的Sn-Ag-Cu接头断裂。但是随着时间的流逝，Sn-Ag-Cu / Sn-Zn-Bi试样的断裂向焊料转移。

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  • 来源
    《Journal of Materials Science》 |2007年第8期|2574-2581|共8页
  • 作者

    Po-Cheng Shih; Kwang-Lung Lin;

  • 作者单位

    Department of Materials Science and Engineering National Cheng-Kung University No.1 Ta-Hsueh Road Tainan 701 Taiwan R.O.C.;

    Department of Materials Science and Engineering National Cheng-Kung University No.1 Ta-Hsueh Road Tainan 701 Taiwan R.O.C.;

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