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首页> 外文期刊>Journal of thermal stresses >Analysis of transient thermoelastic temperature distribution of a thin circular plate and its thermal deflection under uniform heat generation
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Analysis of transient thermoelastic temperature distribution of a thin circular plate and its thermal deflection under uniform heat generation

机译：薄圆板瞬态热弹性温度分布及其均匀发热下的热偏转分析

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摘要

Analysis of transient thermoelastic temperature distribution of a thin circular plate and its thermal deflection under uniform internal heat generation is investigated. The upper and lower surfaces are thermally insulated, while the perimetric surface is subjected to convection heat transfer with convection coefficient h(c) and fluid temperature T-infinity,while the plate is also subjected to uniform internal energy generation g(0) (W.m(-3)). The integral transform method is used to obtain the analytical solution for the temperature field and thermal deflection. As a special case, the mathematical model is prepared for copper material, and temperature distribution is analyzed for two different initial conditions. The results for temperature changes and the thermal deflection are computed numerically and illustrated graphically.
机译：研究了薄圆形板瞬态热弹性温度分布的分析及其在均匀内部发热下的热偏转。 上表面和下表面是热绝缘的，而周边表面与对流系数H（c）和流体温度T-无穷大进行对流传热，而板也经受均匀的内部能量G（0）（WM （-3））。 积分变换方法用于获得温度场和热偏转的分析解决方案。 作为一种特殊情况，为铜材料制备数学模型，分析了两个不同初始条件的温度分布。 温度变化的结果和热偏转在数字上计算并以图形方式示出。

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