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首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Fabrication of Si field emitter array in local vacuum package
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Fabrication of Si field emitter array in local vacuum package

机译:用局部真空封装制造硅场致发射器阵列

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摘要

We have fabricated a local vacuum package enclosing a Si field emitter array on Si substrate. To maintain the low pressure required for electron emission, a titanium evaporation getter was made as a bridge structure with the Si field emitter array in local vacuum package. The local vacuum package technique was adapted to the IC process for on-chip device fabrication. This technique will be very useful for many applications with high performance.
机译:我们已经制造了局部真空封装,在Si基板上封装了一个Si场发射器阵列。为了保持电子发射所需的低压,用局部真空封装中的Si场发射器阵列制作了钛蒸发吸气剂作为桥结构。局部真空封装技术适用于片上器件制造的IC工艺。对于许多具有高性能的应用程序,此技术将非常有用。

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