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Abrasive Capacity of Thin Film Diamond Structures

机译：薄膜金刚石结构的磨料容量

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diamond structures have been produced with a three-step replication technique. First a mould is created using standard silicon wafer patterning technology. Diamond is then chemical vapor deposited onto the mould surface. The last step is to electroplate a nickel backing on the diamond film and remove the silicon mould. Using this technique, diamond pyramids of different size and lateral distribution were produced. The wear rates of brass, steel, aluminium oxide and silicon nitride caused by the diamond structures were compared with those of commercial silicon carbide grinding paper and a diamond grinding disc in a pin-on-disc configuration. The diamond pyramids abraded all materials except brass at a much higher rate than the silicon carbide grinding paper. This was especially pronounced for aluminium oxide.
机译：用三步复制技术生产出金刚石结构。首先，使用标准的硅晶片构图技术创建模具。然后将金刚石化学气相沉积到模具表面上。最后一步是在金刚石膜上电镀镍背衬并去除硅模。使用这种技术，可以生产出不同尺寸和横向分布的钻石金字塔。将金刚石结构导致的黄铜，钢，氧化铝和氮化硅的磨损率与市售的碳化硅磨纸和金刚石磨盘在针盘式结构中的磨损率进行了比较。金刚石棱锥以比碳化硅砂纸高得多的速率磨蚀除黄铜以外的所有材料。这对于氧化铝尤其明显。

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