机译:希尔伯特光谱分析中的电化学噪声对铜含量对银铜合金脱合金过程中相演变的影响
Liaoning Shihua Univ, Sch Mech Engn, Fushun 113001, Peoples R China|Harbin Engn Univ, Key Lab Superlight Mat & Surface Technol, Corros & Protect Lab, Minist Educ, Nantong ST 145, Harbin 150001, Peoples R China;
Liaoning Shihua Univ, Sch Mech Engn, Fushun 113001, Peoples R China;
Natl Sun Yat Sen Univ, Dept Mat & Optoelect Sci, Kaohsiung 804, Taiwan;
Liaoning Shihua Univ, Sch Mech Engn, Fushun 113001, Peoples R China;
Liaoning Shihua Univ, Sch Mech Engn, Fushun 113001, Peoples R China;
Liaoning Shihua Univ, Sch Mech Engn, Fushun 113001, Peoples R China;
Silver; Copper; Corrosion; Diffusion; Electrochemical noise; Hilbert spectra;
机译:Mg-(Ag-Cu)-Y金属玻璃的电化学脱合金纳米多孔双金属Ag-Cu合金的形成与演化
机译:Ag含量对Ag-Al合金脱合金过程中相演变的影响:结合电化学噪声与小波分析
机译:用金属玻璃造成抗菌应用的Mg-(Ag) - (Ag) - (Ag) - (Ag) - (Ag) - (Ag) - 抗菌应用的设计与制备纳米多孔Ag-Cu合金
机译:三元Al_(67)Cu_(18)Sn_(15)合金与二元Al_(75)Cu_(25)合金的电化学脱合金
机译:固定在复合薄膜电极上的金银合金纳米粒子的光学性质和电化学脱合金。
机译:盐酸溶液中恒电位脱合金在Ag-Sn双相合金上纳米多孔银的异步演化
机译:ag-Cu合金在碱性介质中的电化学行为
机译:Cu3au合金化的电化学和扫描隧道显微研究。