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Creep and thermomechanical fatigue properties of in situ Cu_6Sn_5 reinforced lead-free composite solder

机译：原位Cu_6Sn_5增强无铅复合焊料的蠕变和热机械疲劳性能

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摘要

In this research, a composite solder, which consisted of the Sn-3.5Ag eutectic solder matrix and Cu_6Sn_5 intermetallic compounds (IMCs) as reinforcements, was prepared by in situ method. Cu and Sn metallic particles were added into the molten Sn-3.5Ag eutectic solder to form Cu_6Sn_5 reinforcements in solder matrix. After rolling, the Cu_6Sn_5 IMCs are crushed into fine particles and distributed uniformly in the composite solder. The creep and thermomechanical fatigue (TMF) properties of the Sn-3.5Ag eutectic solder and its in situ Cu_6Sn_5 reinforced composite solder joints were successively investigated. The experimental results showed that the in situ Cu_6Sn_5 reinforced composite solder joint exhibited better steady-state creep strain rate, lesser TMF damages and higher residual shear strengths after different number of TMF cycles as compared to the Sn-3.5Ag eutectic solder joint. These indicated that the in situ Cu_6Sn_5 reinforced composite solder possessed excellent creep resistance and TMF properties. Besides, the fracture mode of the in situ Cu_6Sn_5 reinforced composite solder joint and the role of the in situ Cu_6Sn_5 reinforcing particles were analyzed.
机译：本研究采用原位法制备了由Sn-3.5Ag共晶焊料基体和Cu_6Sn_5金属间化合物（IMCs）为增强材料的复合焊料。将铜和锡金属颗粒添加到熔融的Sn-3.5Ag共晶焊料中，以在焊料基质中形成Cu_6Sn_5增强材料。轧制后，将Cu_6Sn_5 IMC压成细颗粒，并均匀分布在复合焊料中。依次研究了Sn-3.5Ag共晶焊料及其原位Cu_6Sn_5增强复合焊料接头的蠕变和热机械疲劳（TMF）性能。实验结果表明，与Sn-3.5Ag共晶焊点相比，原位Cu_6Sn_5增强复合焊点在不同数量的TMF循环后表现出更好的稳态蠕变应变率，更小的TMF损伤和更高的残余剪切强度。这些表明原位Cu_6Sn_5增强复合焊料具有优异的抗蠕变性和TMF性能。此外，还分析了原位Cu_6Sn_5增强复合钎料接头的断裂方式和原位Cu_6Sn_5增强颗粒的作用。

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  • 来源
    《Materials Science and Engineering》 |2010年第15期|p.3335-3342|共8页
  • 作者

    F. Tai; F. Guo; M.T. Han; Z.D. Xia; Y.P. Lei; Y.W. Shi;

  • 作者单位

    College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124 Beijing, China;

    College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124 Beijing, China;

    College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124 Beijing, China;

    College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124 Beijing, China;

    College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124 Beijing, China;

    College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, 100124 Beijing, China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Cu_6Sn_5; in situ composite solder; creep; thermomechanical fatigue;

    机译：Cu_6Sn_5;原位复合焊料;蠕变;热机械疲劳;

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