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Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes

机译：改性碳纳米管增强的无铅纳米复合材料焊料的纳米indentation蠕变性能

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摘要

In this research, creep properties and thermal behavior of Sn-3.5Ag-0.7Cu (SAC)/multi-walled carbon nanotubes (MW-CNTs) lead-free nanocomposite solders was studied by conducting the nanoindentation testing at different temperatures, in the range of 292-312 K. Solder materials were prepared by mechanical alloying followed by powder consolidation routes. Furthermore, nickel coating was electro-less plated on the surface of nanotubes to enhance their metallurgical compatibility with the SAC solder matrix. The content of Ni-coated MW-CNTs varied in the range of 0-0.2 wt%. Addition of Ni-coated nanotubes resulted in an improvement of the indentation creep behavior of SAC solder alloy in comparison with the non-coated agents. By increasing the fraction of Ni-coated MW-CNTs up to ～0.1 wf%, the creep resistance of solder nanocomposite was continuously enhanced. However, the higher contents of reinforcing agents led to the deterioration of creep behavior due to the aggregation of nanotubes and a considerable heterogeneous refinement of the microstructure. The activation energy for softening during localized deformation behavior of nanocomposite solders was estimated by two approaches based on Dom constitutive and Lucas-Oliver creep models and found to be in the ranges of 8.8-18.2 kJ/mol and 17.3-48.4 kJ/mol, respectively. By changing in the activation energy for diffusion and sliding of grain boundaries, in dependency with the extent of grain structural refinement and generation of dislocations due to altering the content of nanotubes as the reinforcing agent, the time-dependent under-loading deformation phenomenon in terms of creep can be controlled. The experimental results revealed that modified carbon nanotubes which are located on sub-grain boundaries can reduce their chemical potential tremendously, suppress the sliding-based creep deformation up to an optimized content of -0.1 wt%.
机译：在该研究中，通过在不同温度下进行纳米狭窄测试，研究了SN-3.5AG-0.7CU（SN-3.5AG-0.7Cu（Sac）/多壁碳纳米管（MW-CNT）无铅纳米复合材料焊料的蠕变性质和热行为。在292-312 K.焊料材料通过机械合金化，然后进行粉末固结途径制备。此外，镍涂层在纳米管的表面上被电镀覆以增强与囊焊料基质的冶金相容性。 Ni涂覆的MW-CNT的含量在0-0.2wt％的范围内变化。与非涂覆剂相比，加入Ni涂覆的纳米管导致囊焊料合金的凹凸蠕变行为改善。通过将Ni涂覆的MW-CNT的级分增加至约0.1wf％，焊料纳米复合材料的蠕变电阻连续增强。然而，增强剂的较高含量导致由于纳米管的聚集以及微结构的相当大的异质细化而导致蠕变行为的劣化。通过基于Dom组成型和Lucas-Oliver蠕变模型的两种方法估计了用于纳米复合焊料的局部变形行为期间的用于软化的激活能量，发现分别为8.8-18.2 kJ / mol和17.3-48.4 kJ / mol的范围。通过在激活能量中改变晶界的扩散和滑动，依赖于晶粒结构细化的程度和由于改变纳米管的含量作为增强剂而产生的脱位，所以依赖于载荷的欠载变形现象可以控制蠕变。实验结果表明，位于亚晶界面上的改性碳纳米管可以极大地降低其化学电位，抑制了较高的滑动的蠕变变形至-0.1wt％的优化含量。

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  • 来源
    《Materials Science and Engineering》 |2020年第21期|140203.1-140203.15|共15页
  • 作者

    F. Khodabakhshi; M. Zareghomsheh; G. Khatibi;

  • 作者单位

    School of Metallurgy and Materials Engineering College of Engineering University of Tehran P.O. Box 11155-4563 Tehran Iran;

    Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics Institute of Chemical Technologies and Analytics Vienna University of Technology Getreidemarkt 9/164 A-1060 Vienna Austria;

    Christian Doppler Laboratory for Lifetime and Reliability of Interfaces in Complex Multi-Material Electronics Institute of Chemical Technologies and Analytics Vienna University of Technology Getreidemarkt 9/164 A-1060 Vienna Austria;

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  • 正文语种 eng
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  • 关键词

    Nanoindentation; Creep behavior; Lead-free solders; SAC alloy; Nanocomposite; MW-CNTs;

    机译：纳米intentation;蠕变行为;无铅焊料;囊合金;纳米复合材料;mw-cnts.;

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