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首页> 外文期刊>Materials Science and Engineering >Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil
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Bonding and strengthening mechanism of ultrasonically soldered 7075 Al joint using Ni-foam/Sn composite solder foil

机译：使用Ni-Foam / Sn复合焊料的超声焊接7075 Al关节的粘合和强化机理

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摘要

Ni-foam reinforced Sn-based composite solder was employed to join ultrafine grain 7075 Al alloy with the assistance of ultrasound. The solder seam was mainly composed of Ni skeletons, Sn-based solder, α-Al phase and very fine (hundreds of nanometers to several microns diameter) Ni_3Sn_4 particles. Discontinuous networks surrounded by the fine Ni_3Sn_4 and α-Al particles were in-situ formed in the solder seam, the diameter of which was decreased with increasing soldering time. Smooth transition of the lattice from Al substrate to Sn-based solder was achieved by the formation of an amorphous Al_2O_3 interlayer at the interface. The microstructure evolution mechanism and the amorphous Al_2O_3 interlayer formation mechanism are discussed in detail. The shear strength of Al/Ni-Sn/Al joints increased with prolonging soldering time. The Al/Ni-Sn/Al joint ultrasonically soldered for 60 s exhibits a shear strength of 71.4 MPa, which was approximately 37% higher than that soldered with pure Sn solder.
机译：使用Ni-FoAM增强的Sn基复合焊料在超声中加入超细谷物7075 Al合金。焊缝主要由Ni骨架，Sn基焊料，α-Al相和非常精细（数百纳米至几微米直径）Ni_3SN_4颗粒组成。由精细Ni_3SN_4和α-Al颗粒包围的不连续网络在焊缝中形成原位，其直径随着焊接时间的增加而降低。通过在界面处形成无定形的Al_2O_3中间层，实现了将晶格从Al底物的焊料过渡到Sn基焊料。详细讨论了微观结构演化机制和无定形AL_2O_3层间形成机制。 Al / Ni-Sn / Al关节的剪切强度随着延长的焊接时间而增加。 al / Ni-Sn / Al接头透过60秒的抗剪力强度为71.4MPa，比用纯Sn焊料焊接的剪切强度高约37％。

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  • 来源
    《Materials Science and Engineering》 |2020年第jul22期|139691.1-139691.9|共9页
  • 作者

    Yong Xiao; Zhipeng Song; Shan Li; Dan Li; Zhihao Zhang; Mingyu Li; Russell Goodall;

  • 作者单位

    School of Materials Science and Engineering Wuhan University of Technology Wuhan 430070 China Department of Materials Science and Engineering The University of Sheffield Sheffield S1 3JD UK;

    School of Materials Science and Engineering Wuhan University of Technology Wuhan 430070 China;

    School of Materials Science and Engineering Wuhan University of Technology Wuhan 430070 China;

    School of Materials Science and Engineering Wuhan University of Technology Wuhan 430070 China;

    Fujian Key Laboratory of Advanced Materials College of Materials Xiamen University Xiamen 361005 China;

    Flexible Printing Electronic Technology Center Harbin Institute of Technology at Shenzhen Shenzhen 518055 China;

    Department of Materials Science and Engineering The University of Sheffield Sheffield S1 3JD UK;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    Ultrafine grained Al alloy; Ni-foam/Sn composite solder; Ultrasonic soldering; Microstructure; Bonding mechanism;

    机译：超细颗粒Al合金;Ni-Foam / Sn复合焊料;超声波焊接;微观结构;粘接机制;

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