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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >Grain growth and texture evolution in electroformed copper liners of shaped charges
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Grain growth and texture evolution in electroformed copper liners of shaped charges

机译：异型装药电铸铜衬里的晶粒长大和织构演变

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摘要

Electron backscattered Kikuchi patterns (EBSP) and optical microscopy (OM) have been employed to reveal grain growth and texture evolution in electroformed copper liners of shaped charges with ultrafine grains and a strong (110) fiber texture, which were annealed at various temperatures. By annealing below 410 ℃, the grains grow uniformly and show a normal growth. By annealing at 530 ℃, a different growth mode has been observed. The grains grow non-uniformly by the growth of a few grains and numerous annealing twins were observed in the samples. Up to 650 ℃ annealing, extensive abnormal grain growth appears in the sample. EBSP analysis shows that the <110> fiber texture, which exists originally in the as-electroformed copper sample, was weakened and tended to disappear during grain growth with increasing annealing temperature over 410 ℃. Meanwhile, the changes of grain boundary misorientations in specimens subjected to higher annealing temperature (530 ℃ and 650 ℃) suggest that a progressive weakening of the <110> fiber texture results in decreasing in the fraction of low-angle boundaries. Possible recrystallization mechanism in electroformed copper liners of shaped charges is discussed.
机译：已采用电子背散射菊池图案（EBSP）和光学显微镜（OM）来揭示电铸铜衬里中晶粒的生长和织构演变，该衬里带有超细晶粒和强（110）纤维织构，并在不同温度下进行了退火。通过在410℃以下退火，晶粒均匀生长并显示出正常的生长。通过在530℃退火，可以观察到不同的生长模式。晶粒由于少数晶粒的生长而不均匀地生长，并且在样品中观察到许多退火孪晶。在最高650℃的退火温度下，样品中会出现大量异常晶粒生长。 EBSP分析表明，随着410℃退火温度的升高，原来存在于电铸铜样品中的<110>纤维织构被削弱并趋于消失。同时，在较高退火温度（530℃和650℃）下的试样中晶界取向错误的变化表明<110>纤维织构的逐渐弱化导致低角度晶界的分数降低。讨论了电成形异型装药铜衬里可能的重结晶机理。

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