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首页> 外文期刊>Materials Science and Engineering >Ultra sharp Berkovich indenter used for nanoindentation studies of TiB_2 thin films
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Ultra sharp Berkovich indenter used for nanoindentation studies of TiB_2 thin films

机译：超锐化Berkovich压头用于TiB_2薄膜的纳米压痕研究

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摘要

TiB_2 thin films (～100nm thick) were deposited on c-Si (100) wafers employing the d.c. unbalanced magnetron sputtering (UMS) technique. The influence of negative substrate bias V_b on the mechanical properties of TiB_2 films was studied. Structural and morphological results were obtained by X-ray diffraction (XRD) and X-ray reflectivity (XRR) analysis whereas the mechanical properties were measured by means of depth sensing nanoindentation (Nl). A detailed study of the influence of substrate mechanical properties on the measured elastic modulus (E) and hardness (H) was carried out using one sharp (BRK50) and one ultra sharp (BRK20) Berkovich type diamond tips with tip roundness 50 and 20 nm respectively. Bhattacharya-Nix (1988) [15] modified model was applied to assess thin film's intrinsic mechanical properties. Structural, morphological and mechanical testing results showed an improvement of mechanical properties of TiB_2 thin films with the increase of the applied substrate bias voltage. Additionally they implied that BRK20 experimental results were less affected by substrate's mechanical properties.
机译：使用直流电将TiB_2薄膜（约100nm厚）沉积在c-Si（100）晶片上。不平衡磁控溅射（UMS）技术。研究了负衬底偏压V_b对TiB_2薄膜力学性能的影响。通过X射线衍射（XRD）和X射线反射率（XRR）分析获得结构和形态结果，而机械性能通过深度感测纳米压痕（N1）测量。使用一根尖度为50和20 nm的Berkovich型尖锐金刚石尖（BRK50）和一种超尖锐（BRK20）细致地研究了基材机械性能对测得的弹性模量（E）和硬度（H）的影响分别。 Bhattacharya-Nix（1988）[15]修改后的模型用于评估薄膜的固有机械性能。结构，形态和力学测试结果表明，随着所施加衬底偏压的增加，TiB_2薄膜的力学性能得到改善。此外，他们暗示BRK20实验结果受基材机械性能的影响较小。

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