Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang; K.N.Tu

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Structure and properties of lead-free solders bearing micro and nano particles

机译：带有微米和纳米颗粒的无铅焊料的结构和性能

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摘要

Composite lead-free solders, containing micro and nano particles, have been widely studied. Due to grain boundary drag or Zener drag, these particles can refrain the solder microstructure from coarsening in services, especially for Cu_6Sn_5, Ag_3Sn intermetallic compounds and the β-Sn phases. Due to dispersion hardening or dislocation drag, the mechanical properties of the composite solder alloys were enhanced significantly. Moreover, these particles can influence the rate of interfacial reactions, and some particles can transform into a layer of intermetallic compound. Wettability, creep resistance, and hardness properties were affected by these particles. A systematic review of the development of these lead-free composite solders is given here, which hopefully may find applications in microbumps to be used in the future 3D IC technology.

机译：包含微米和纳米颗粒的复合无铅焊料已得到广泛研究。由于晶界阻力或齐纳阻力，这些颗粒可抑制焊料微观结构的粗化，特别是对于Cu_6Sn_5，Ag_3Sn金属间化合物和β-Sn相。由于分散硬化或位错阻力，复合焊料合金的机械性能显着提高。而且，这些颗粒可以影响界面反应的速率，并且一些颗粒可以转变成金属间化合物层。这些颗粒影响润湿性，抗蠕变性和硬度性能。本文对这些无铅复合焊料的开发进行了系统的综述，希望可以在未来3D IC技术中使用的微型凸点中找到应用。

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来源
《Materials Science & Engineering》 |2014年第8期|1-32|共32页
作者
Liang Zhang; K.N.Tu;
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作者单位

School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China;

Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095, USA;

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原文格式 PDF
正文语种 eng
中图分类
关键词
Nano-particles; Lead-free solders; Creep; Intermetallic compounds;

机译：纳米颗粒;无铅焊料;蠕变;金属间化合物;

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Structure and properties of lead-free solders bearing micro and nano particles

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