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首页> 外文期刊>Mathematical Problems in Engineering >Analytical Solutions of Heat Transfer and Film Thickness with Slip Condition Effect in Thin-Film Evaporation for Two-Phase Flow in Microchannel
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Analytical Solutions of Heat Transfer and Film Thickness with Slip Condition Effect in Thin-Film Evaporation for Two-Phase Flow in Microchannel

机译：微通道两相流薄膜蒸发中具有滑移条件效应的传热和膜厚度的解析解

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摘要

Physical and mathematical model has been developed to predict the two-phase flow and heat transfer in a microchannel with evaporative heat transfer. Sample solutions to the model were obtained for both analytical analysis and numerical analysis. It is assumed that the capillary pressure is neglected (Morris, 2003). Results are provided for liquid film thickness, total heat flux, and evaporating heat flux distribution. In addition to the sample calculations that were used to illustrate the transport characteristics, computations based on the current model were performed to generate results for comparisons with the analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). The calculated results from the current model match closely with those of analytical results of Wang et al. (2008) and Wayner Jr. et al. (1976). This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region and develop an analytical equation for evaporating liquid film thickness.
机译：已经开发出物理和数学模型来预测具有蒸发热传递的微通道中的两相流动和热传递。获得了该模型的样本解决方案，用于分析分析和数值分析。假设忽略了毛细管压力（Morris，2003年）。提供了液膜厚度，总热通量和蒸发热通量分布的结果。除了用于说明运输特性的样本计算外，还基于当前模型进行了计算以生成结果，以便与Wang等人的分析结果进行比较。 （2008）和Wayner Jr.等。 （1976）。当前模型的计算结果与Wang等人的分析结果非常吻合。 （2008）和Wayner Jr.等。 （1976）。这项工作将使人们更好地了解在蒸发膜区域中发生的传热和流体流动，并为蒸发液膜厚度建立解析方程。

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