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首页> 外文期刊>Micro & Nano Letters, IET >Microfluidic chip using foil-assisted CO2 laser ablation for suspended particle separation
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Microfluidic chip using foil-assisted CO2 laser ablation for suspended particle separation

机译：箔辅助CO 2 激光烧蚀微流控芯片分离悬浮颗粒

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摘要

Separation is one of the important pretreatment processes during detection in lab-on-a-chip. In this reported work, polydimethylsiloxane (PDMS) on a glass microchip with a combination of the spiral channel and backward facing step structure was designed to optimise the separation of suspended particles without any extra active powers of the electric or magnetic field. The spiral microfluidic chip was fabricated first by the foil-assisted CO laser ablated polymethylmethacrylate (PMMA) master mould, followed by repetitive PDMS moulding and then bonded to a glass substrate. The CO laser ablation of PMMA in air normally generated poor surface quality comprising bulges and scorches. The metal-foil-assisted laser ablation can effectively improve the above defects with conducting cover protection. The average height of the bulges was reduced from 5.0 to 1.5 μm and the channel width was reduced from 230 to 120 μm. The finished separation chips were operated at various syringe-controlled flow rates of 5–20 µL/min to test the performance. A high separation efficiency of about 99% could be achieved within a certain flow range of less than 15 µL/min under the simple structure with low-cost and time-saving.
机译：分离是芯片实验室检测过程中重要的预处理过程之一。在这项已报道的工作中，设计了具有螺旋通道和向后阶梯结构结合的玻璃微芯片上的聚二甲基硅氧烷（PDMS），以优化悬浮颗粒的分离，而没有电场或磁场的任何额外有功功率。螺旋微流控芯片首先通过箔辅助的CO激光烧蚀聚甲基丙烯酸甲酯（PMMA）主模制造，然后进行重复的PDMS成型，然后粘合到玻璃基板上。空气中PMMA的CO激光烧蚀通常会产生不良的表面质量，包括凸出和焦烧。金属箔辅助激光烧蚀可以有效地改善上述缺陷，并进行覆盖保护。凸起的平均高度从5.0减少到1.5μm，通道宽度从230减少到120μm。完成的分离芯片以5–20 µL / min的各种注射器控制流速运行，以测试性能。在简单的结构下，低成本和省时的情况下，在小于15 µL / min的特定流量范围内，可以实现约99％的高分离效率。

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