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首页> 外文期刊>Microelectromechanical Systems, Journal of >Fabrication of Large-Area Three-Dimensional Microstructures on Flexible Substrates by Microtransfer Printing Methods
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Fabrication of Large-Area Three-Dimensional Microstructures on Flexible Substrates by Microtransfer Printing Methods

机译：通过微转移印刷方法在柔性基板上制备大面积三维微结构

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摘要

This paper presents two robust microtransfer printing methods, namely, multiple transfer printing and peeling microprinting methods, to fabricate three-dimensional (3-D) and high-aspect-ratio microelectromechanical systems (MEMS) structures over large areas on flexible polydimethylsiloxane (PDMS) substrates. These techniques enable conformal wrapping of 3-D microstructures, initially fabricated in two-dimensional (2-D) layouts with standard fabrication technology onto a wide range of surfaces with complex and curvilinear shapes. The processes exploit the differential adhesive tendencies of the microstructures formed between a donor and a transfer substrate to accomplish an efficient release and transfer process. Experimental and theoretical studies show that the MEMS structures with a wide variety of pattern densities can be conformally transferred to bendable device substrates while keeping the structural integrity and density intact. Quantitative stress analysis on the micromechanics of such a curvilinear system suggests that the stress induced by wrapping the complete structure onto a cylinder is mostly in the flexible PDMS substrate, while the MEMS structures experience little stress. $hfill$[2011-0260]
机译：本文介绍了两种可靠的微转移印刷方法，即多次转移印刷和剥离微印刷方法，以在柔性聚二甲基硅氧烷（PDMS）上大面积制造三维（3-D）和高纵横比微机电系统（MEMS）结构。基材。这些技术能够将3-D微观结构进行保形包裹，最初采用标准制造技术以二维（2-D）布局将其制造到各种形状复杂且曲线形状的表面上。该方法利用在供体和转移基材之间形成的微结构的不同的粘附趋势，以完成有效的释放和转移过程。实验和理论研究表明，具有多种图案密度的MEMS结构可以保形地转移到可弯曲的设备基板上，同时保持结构完整性和密度不变。在这种曲线系统的微力学上进行的定量应力分析表明，将整个结构包裹在圆柱体上而产生的应力主要在柔性PDMS基板中，而MEMS结构几乎没有应力。 $ hfill $ [2011-0260]

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