Microstructure characterization of SnAgCu solder bearing Ce for electronic packaging

著录项

• 来源
  《Microelectronic Engineering》 |2011年第9期|p.2848-2851|共4页
• 作者

  Liang Zhang; Song-bai Xue; Li-li Gao; Wei Dai; Feng Ji; Yan Chen; Sheng-lin Yu;

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• 作者单位

  College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,School of Mechanical & Electrical Engineering, Xuzhou Normal University, Xuzhou 221116, China;

  College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;

  College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;

  College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;

  College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;

  Harbin Welding Institute, Harbin 150080, China;

  College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China,The 14th Research Institute, China Electronics Technology Croup Corporation, Nanjing210013, China;

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• 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  creep-rupture lives; lead-free solder joints; creep behavior; intermetallic compound; effect mechanism;

  机译：蠕变断裂寿命;无铅焊点;蠕变行为;金属间化合物;作用机理;