Electroplating using high-aspect-ratio microstructures fabricated by proton beam writing

著录项

• 来源
  《Microelectronic Engineering》 |2009年第6期|945-948|共4页
• 作者

  Y. Seki; Y. Furuta; H. Nishikawa; T. Watanabe; T. Nakata; T. Satoh; Y. Ishii; T. Kamiya;

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• 作者单位

  Department of Electrical Engineering, Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, Japan;

  Department of Electrical Engineering, Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, Japan;

  Department of Electrical Engineering, Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, Japan Research Organization for Advanced Engineering, Shibaura Institute of Technology, 307 Ohaza Fukasaku, Minuma-ku, Saitama, Saitama 337-8570, Japan;

  Research Organization for Advanced Engineering, Shibaura Institute of Technology, 307 Ohaza Fukasaku, Minuma-ku, Saitama, Saitama 337-8570, Japan;

  Research Organization for Advanced Engineering, Shibaura Institute of Technology, 307 Ohaza Fukasaku, Minuma-ku, Saitama, Saitama 337-8570, Japan;

  Takasaki Advanced Radiation Research Institute, Japan Atomic Energy Agency, 1233 Watanuki-machi, Takasaki, Gunma 370-1292, Japan;

  Takasaki Advanced Radiation Research Institute, Japan Atomic Energy Agency, 1233 Watanuki-machi, Takasaki, Gunma 370-1292, Japan;

  Takasaki Advanced Radiation Research Institute, Japan Atomic Energy Agency, 1233 Watanuki-machi, Takasaki, Gunma 370-1292, Japan;

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• 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  proton beam writing; electroplating; microstructures; PMMA;

  机译：质子束书写电镀;微观结构聚甲基丙烯酸甲酯;