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Development of high-temperature solders: Review

机译：高温焊料的开发：回顾

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摘要

The development of lead-free solder alloys for high-temperature applications is required to meet increasing demands for reliable replacements for lead-containing alloys. This paper provides a review of recent research on suitable replacement alloys, as well as traditional Pb-Sn alloys, collating relevant properties and identifying areas where further development is required. The main candidate alloys covered are derived from the Au-Sn, Au-Ge, Zn-Al, Zn-Sn, Bi-Ag and Sn-Sb alloy systems. Each of these systems is discussed with respect to the advantages and disadvantages associated with their use in soldering applications. It is concluded that further development of alloys suitable for high-temperature lead-free soldering applications is required.
机译：为了满足对可靠替代含铅合金不断增长的需求，需要开发用于高温应用的无铅焊料合金。本文概述了有关合适的替代合金以及传统的Pb-Sn合金的最新研究，整理了相关性能并确定了需要进一步开发的领域。覆盖的主要候选合金来自Au-Sn，Au-Ge，Zn-Al，Zn-Sn，Bi-Ag和Sn-Sb合金体系。这些系统中的每一个都针对在焊接应用中使用它们的优缺点进行了讨论。结论是，需要进一步开发适用于高温无铅焊接应用的合金。

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  • 来源
    《Microelectronics & Reliability》 |2012年第7期|p.1306-1322|共17页
  • 作者

    Guang Zeng; Stuart McDonald; Kazuhiro Nogita;

  • 作者单位

    School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia;

    School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia;

    School of Mechanical and Mining Engineering, The University of Queensland, Brisbane, Australia;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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