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Cu diffusion in Ag-plated Cu leadframe packages

机译：镀银铜引线框架封装中的铜扩散

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摘要

Cu diffusion onto an Ag-plated Cu leadframe surface was detected by Energy Dispersive X-ray (EDX) after de-capsulating the molded package. However, no Cu was detected by EDX on the Ag surfaces of bare leadframe, leadframe after die attachment including die attachment curing, or leadframe after wire bonding. Temperature simulation of molding and post-molding curing show that the temperature and its duration have some impact on the Cu diffusion, which is as expected. Interestingly, this study shows that the Cu diffusion onto the interface of the Ag-plated surface and mold compound is very much dependent on the type of mold compound used, which has never been reported in the literature so far. The Cu diffusion was detected by EDX only for certain types of mold compounds used. It is concluded that the mold compound is a major contributor to the Cu diffusion observed. This is possibly because S and O in the mold compound react with Cu and form copper sulfides and copper oxides, which accelerate the Cu diffusion from the Cu leadframe substrate onto the interface of the Ag surface and mold compound.
机译：解封成型封装后，通过能量色散X射线（EDX）检测到铜扩散到镀银的铜引线框架表面。但是，EDX不能在裸露的引线框，裸片附着后的引线框（包括裸片附着固化）或引线键合后的引线框的Ag表面上检测到Cu。模塑和模塑后固化的温度模拟表明，温度及其持续时间对铜的扩散有一定影响，这是可以预期的。有趣的是，这项研究表明，铜扩散到镀银表面和模塑化合物界面上的程度在很大程度上取决于所用模塑化合物的类型，迄今为止，尚未在文献中进行报道。仅对于某些类型的模塑料，通过EDX检测到Cu扩散。结论是，模塑料是观察到的Cu扩散的主要贡献者。这可能是因为模塑料中的S和O与Cu反应并形成硫化铜和氧化铜，从而加速了Cu从Cu引线框基板到Ag表面与模塑料界面的扩散。

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  • 来源
    《Microelectronics & Reliability》 |2012年第7期|p.1523-1527|共5页
  • 作者

    Wu-Hu Li; S.W. Joelle Ong;

  • 作者单位

    Infineon Technologies Asia Pacific Pte Ltd., 168 Kallang Way, Singapore 349253, Republic of Singapore;

    Infineon Technologies Asia Pacific Pte Ltd., 168 Kallang Way, Singapore 349253, Republic of Singapore;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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