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首页> 外文期刊>Microelectronics & Reliability >Calculation of direct tunneling gate current through ultra-thin oxide and oxide/nitride stacks in MOSFETs and H-MOSFETs
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Calculation of direct tunneling gate current through ultra-thin oxide and oxide/nitride stacks in MOSFETs and H-MOSFETs

机译:通过MOSFET和H-MOSFET中的超薄氧化物和氧化物/氮化物叠层计算直接隧穿栅极电流

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摘要

This theoretical work investigates some aspects of direct tunneling gate current in ultra-thin gate MOSFET, as influence of bias, oxide thickness, and oxide thickness fluctuations. We study two alternative device architectures to reduce this effect. They consist in either increasing the insulator thickness using a high permitivity nitride/oxide stack or burying the channel, due to a tensile strained IV-IV heterostructure. The presented calculations have been performed by coupling a semi-classical approach of direct tunneling computation with the 2D Monte Carlo device simulation.
机译:这项理论工作研究了超薄栅极MOSFET中直接隧穿栅极电流的某些方面,如偏置,氧化物厚度和氧化物厚度波动的影响。我们研究了两种替代的设备架构来减小这种影响。由于采用拉伸应变的IV-IV异质结构,它们要么采用高介电常数的氮化物/氧化物叠层来增加绝缘体的厚度,要么将沟道掩埋。通过将直接隧道计算的半经典方法与2D蒙特卡洛设备仿真相结合来执行所提出的计算。

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