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首页> 外文期刊>NDT & E international >In-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight System
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In-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight System

机译:使用Terahertz-Time飞行系统的半导体封装产品中的原位厚度测量。

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摘要

Refractive index and thickness of an epoxy molding compound (EMC) were successfully measured without any advance knowledge of properties of material using the Terahertz-Time of Flight System (THz-TFS). The theoretical analysis for calculation of the refractive index and thickness of EMC was conducted considering two time-delay values of emission and detection mode (normal reflection mode and transmission mode). By combining two time-delay values from the normal reflection and transmission modes, the refractive index of EMC could be directly deduced without any parameter of the properties of specimen. The thickness of EMC mold could be simultaneously calculated by using only THz time-delay values. The thickness measurement results using THz-TFS were verified with the thickness measured through scanning electron microscopy (SEM).
机译:成功测量环氧成型化合物(EMC)的折射率和厚度,而无需使用飞行系统的太赫兹 - 时间(THz-TFS)的材料性能的任何先进知识。考虑到发射和检测模式的两个时间延迟值(正常反射模式和传输模式)进行了计算折射率和EMC厚度的理论分析。通过组合来自正常反射和传输模式的两个时间延迟值,可以直接推导出EMC的折射率而没有样本性质的任何参数。可以通过仅使用THz时延值同时计算EMC模具的厚度。使用THZ-TFS的厚度测量结果以扫描电子显微镜(SEM)测量的厚度验证。

著录项

  • 来源
    《NDT & E international》 |2019年第7期|11-18|共8页
  • 作者单位

    Hanyang Univ Dept Mech Convergence Engn 222 Wangsimni Ro Seoul South Korea;

    Hanyang Univ Dept Mech Convergence Engn 222 Wangsimni Ro Seoul South Korea;

    Hanyang Univ Dept Mech Convergence Engn 222 Wangsimni Ro Seoul South Korea;

    Hanyang Univ Dept Mech Convergence Engn 222 Wangsimni Ro Seoul South Korea|Hanyang Univ Inst Nano Sci & Technol 222 Wangsimni Ro Seoul South Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Measurement; Non-contact; Terahertz waves; Thickness;

    机译:测量;非接触;太赫兹波;厚度;

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