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Fiber misalignment in silicon V-groove based optical modules

机译：基于硅V槽的光模块中的光纤未对准

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摘要

The use of anisotropically etched silicon optical benches (SiOB) and optical adhesives have attracted much attention for the low cost assembly of optical modules. In this paper, the effect of attachment process parameters (such as the amount of bulk adhesive, and the thickness/symmetry of the adhesive layer between the fiber and V-groove walls) on the alignment of the fiber with the laser diode assembled on SiOB, is studied. Finite element analysis (FEA) on the fiber displacement within the V-groove at a given temperature, increases significantly for different thicknesses of adhesive layers, present on either side of the fiber but does not change much with the total amount of adhesive in the module. Validation of the FEA data was accomplished by the use of in situ micro moire in-terferometry, involving determination of the displacement of the centre of the fiber in the V-groove exposed to a temperature excursion ranging from room temperature to 125℃. Maximum displacements of the fiber centre in the vertical and horizontal directions relative to the SiOB were found to range between 0.69-1.21 and 0.36-0.42 μm, respectively at 100℃. The misalignment results obtained by moke interferometry matched favorably with the finite element data. The simulation and experimental data in this study indicates that fiber misalignment due to temperature cycling can be reduced significantly if the fiber is located equidistant from the two inclined walls of the Si V-groove.
机译：各向异性蚀刻的硅光具座（SiOB）和光学粘合剂的使用已引起光学模块的低成本组装的广泛关注。在本文中，附着工艺参数（例如本体粘合剂的数量以及光纤和V型槽壁之间的粘合剂层的厚度/对称性）对光纤与在SiOB上组装的激光二极管对准的影响，正在研究中。对于给定温度下V形槽内纤维位移的有限元分析（FEA）对于存在于纤维两侧的不同厚度的粘合剂层会显着增加，但不会随模块中粘合剂总量的变化而变化。 FEA数据的验证是通过使用原位微莫尔干涉仪完成的，涉及确定暴露于室温至125℃的温度波动的V型槽中纤维中心的位移。相对于SiOB，在100℃下纤维中心在垂直和水平方向上的最大位移分别在0.69-1.21和0.36-0.42μm之间。通过莫克干涉测量法获得的失准结果与有限元数据相吻合。这项研究中的仿真和实验数据表明，如果光纤与Si V槽的两个倾斜壁等距放置，则可以显着降低由于温度循环而导致的光纤错位。

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