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首页> 外文期刊>Sensors Journal, IEEE >Characterization of Single-Photon Avalanche Diodes in a 0.5 m Standard CMOS Process—Part 1: Perimeter Breakdown Suppression
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Characterization of Single-Photon Avalanche Diodes in a 0.5 m Standard CMOS Process—Part 1: Perimeter Breakdown Suppression

机译:0.5 m标准CMOS工艺中单光子雪崩二极管的特性表征-第1部分:周边击穿抑制

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摘要

We report on the breakdown characteristics of a single-photon avalanche diode structure fabricated in a $0.5 mu$m single-well CMOS process. This paper features two mechanisms for reducing perimeter breakdown. The first mechanism consists of using the lateral diffusion of adjacent n-wells to reduce the electric field at the diode's periphery, and the second makes use of a poly-silicon gate over the high field regions to modulate the electric field. We studied each technique independently as well as their combined effect on the devices' avalanche profiles. In addition to marked alterations in the current-voltage curves near and above breakdown, the diodes' breakdown voltages were increased by more than 4 V, indicating that perimeter breakdown was curtailed.
机译:我们报告了以0.5微米的单阱CMOS工艺制造的单光子雪崩二极管结构的击穿特性。本文介绍了两种减少周界故障的机制。第一种机制是利用相邻n阱的横向扩散来减小二极管外围的电场,第二种机制是利用高场区域上方的多晶硅栅极来调制电场。我们独立研究了每种技术及其对设备雪崩曲线的综合影响。除了击穿附近和击穿附近的电流-电压曲线有明显变化外,二极管的击穿电压也增加了4 V以上,这表明周边击穿受到了限制。

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