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Effect of gamma-ray irradiation on the device process-induced defects in 4H-SiC epilayers

机译:γ射线辐照对器件过程中4H-SiC外延层缺陷的影响

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We investigated the gamma-ray irradiation effect on 4H-SiC device process-induced defects by photoluminescence (PL) imaging and deep level transient spectroscopy (DLTS). We found that basal plane dislocations (BPDs) that were present before the irradiation were eliminated by gamma-ray irradiation of 1 MGy. The reduction mechanism of BPD was discussed in terms of BPD-threading edge dislocation (TED) transformation and shrinkage of stacking faults. In addition, the entire PL image was gradually darkened with increasing absorbed dose, which is presumably due to the point defects generated by gamma-ray irradiation. We obtained DLTS peaks that could be assigned to complex defects, termed RD series, and found that the peaks increased with absorbed dose.
机译:我们通过光致发光(PL)成像和深能级瞬态光谱(DLTS)研究了伽玛射线对4H-SiC器件工艺引起的缺陷的影响。我们发现,通过1 MGy的伽马射线辐照消除了辐照前存在的基底平面位错(BPD)。从BPD-线程边缘错位(TED)变换和堆垛层错收缩的角度讨论了BPD的减少机制。另外,随着吸收剂量的增加,整个PL图像逐渐变暗,这可能是由于伽马射线辐照产生的点缺陷。我们获得了可归因于复杂缺陷的DLTS峰,称为RD系列,发现该峰随吸收剂量的增加而增加。

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