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Automated reader speeds wafer fabrication

机译：自动读取器可加快晶圆制造速度

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摘要

To ensure that semiconductor wafers move seamlessly though the fabrication process, they must be kept in correct orientation. A number of semiconductor-equipment vendors offer wafer-notch-alignment systems that rotate the wafers vertically across pressure-sensitive rollers. Controlled by microprocessors, these systems align single or multiple wafers by detecting the difference in pressure on the roller between the curved surface of the wafer and the notch. Such alignment capability ensures compatibility between wafer-handling systems of different manufacturers. Wafers are often marked with both alphanumeric and data-matrix codes to allow them to be traced as they move through the fabrication processes. Laser marking systems place these characters and codes on each side of the wafer. Following standards developed by Semiconductor Equipment and Materials International (SEMI; San Jose, CA, USA; www.semi.org), specified as SEMI T7 and SEMI M1.15, both alphanumeric characters and data-matrix code are scribed at a specific distance from the notch of each wafer.
机译：为了确保半导体晶片在整个制造过程中无缝移动，必须将它们保持正确的方向。许多半导体设备供应商提供晶圆缺口对准系统，该系统可以使晶圆在压敏辊上垂直旋转。这些系统由微处理器控制，通过检测晶片弯曲表面和凹口之间的辊上压力差来对准单个或多个晶片。这种对准能力确保了不同制造商的晶片处理系统之间的兼容性。晶圆通常同时标有字母数字和数据矩阵代码，以使晶圆在制造过程中移动时可以被追踪。激光打标系统将这些字符和代码放在晶圆的每一面上。遵循半导体设备和材料国际组织（SEMI；美国加利福尼亚州圣何塞； www.semi.org）制定的标准，指定为SEMI T7和SEMI M1.15，字母数字字符和数据矩阵代码均在特定距离处刻划。从每个晶圆的缺口开​​始。

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