机译:Effects of Surface Cleanness, Bonding Pressure and Contact Area of ACF on Interfacial Impedance of Chip on Glass Bonding in Flat Panel Display Assembly
机译:Electrical and Physical Characteristics of Ba(Zr_(0.1)Ti_(0.9))O_3 Thin Films under Oxygen Plasma Treatment for Nonvolatile Memory Devices Application
机译:Effects of Surface Cleanness, Bonding Pressure and Contact Area of ACF on Interfacial Impedance of Chip on Glass Bonding in Flat Panel Display Assembly