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Preparation and dielectric properties of polyimide foams containing crosslinked structures

机译:含交联结构的聚酰亚胺泡沫的制备及其介电性能

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摘要

In order to obtain cellular materials with low dielectric properties, crosslinked polyimide foams were prepared using 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 4,4'-oxydianiline (ODA) and 2,4,6-triaminopyrimidine (TAP) as monomer via a poly(ester-amine salt) precursor process. The structures of the precursors and the polyimide foams were characterized by thermogravimetric analysis (TGA) and FT-IR, while the morphologies of the polyimide foams were viewed from scanning electron microscopy (SEM) measurements. The results revealed that the poly(ester-amine salt) precursor containing TAP could successfully be converted to a crosslinked polyimide foam with relatively uniform cell structure. Also, the crosslinking of TAP improved the mechanical properties of foams in comparison with the non-crosslinking systems. With increasing content of TAP, the dielectric constants of the polyimide foams decreased gradually. For the foam with TAP molar ratio at 15%, the dielectric constant was as low as 1.77 at the frequency of 10 kHz. Though the thermal resistance decreased slightly for crosslinked foams, the decomposition temperatures were still maintained above 520℃.
机译:为了获得具有低介电性能的多孔材料,使用3,3',4,4'-二苯甲酮四羧酸二酐(BTDA),4,4'-氧二苯胺(ODA)和2,4,6-三氨基嘧啶制备了交联的聚酰亚胺泡沫(TAP)通过聚(酯胺盐)前体工艺作为单体。前驱体和聚酰亚胺泡沫的结构通过热重分析(TGA)和FT-IR进行了表征,而聚酰亚胺泡沫的形貌则通过扫描电子显微镜(SEM)进行了观察。结果表明,含有TAP的聚(酯-胺盐)前体可以成功地转化为具有相对均匀泡孔结构的交联聚酰亚胺泡沫。而且,与非交联体系相比,TAP的交联改善了泡沫的机械性能。随着TAP含量的增加,聚酰亚胺泡沫的介电常数逐渐降低。对于TAP摩尔比为15%的泡沫,在10kHz的频率下介电常数低至1.77。尽管交联泡沫的耐热性略有下降,但分解温度仍保持在520℃以上。

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