At ECS 2013, Bayer MaterialScience presented a technology for heat-activated dispersion adhesives that is based on the new polycarbodiimide crosslinker Desmodur XP 2802. This technology particularly offers advantages for applications in which web-like substrates must be bonded together and quickly achieve high strength at the joint. "Roll-to-roll bonding processes in the packaging and textile industries can benefit from this technology most of all," said adhesive raw materials expert Jorg Buchner of Bayer MaterialScience.
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