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首页> 外文期刊>Proceedings of the Institution of Mechanical Engineers, Part O. Journal of Risk and Reliability >A reliability assessment method based on an accelerated testing under thermal cycling environment
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A reliability assessment method based on an accelerated testing under thermal cycling environment

机译：热循环环境下基于加速试验的可靠性评估方法

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摘要

This article proposes a reliability assessment method based on an accelerated testing under thermal cycling environment to assess the reliability of an electronic device with multiple failure modes. First, two typical failure modes of the electronic devices in the thermal environment are analyzed. It is concluded that the reliability of a complicated electronic device (with both the two typical failure modes) is difficult to assess through the existing accelerated testing methods. Second, an acceleration model is established by combining the Arrhenius model with the Norris-Landzberg model. The influences of the thermal cycling environment on both the typical failures are taken into account in this model. Third, a thermal cycling test plan is developed, and a new approach is proposed to evaluate the reliability of an electronic device with multiple failure modes. Finally, a numerical example is illustrated to demonstrate the feasibility of proposed method, and the calculation results show the efficiency of the proposed method.
机译：本文提出了一种基于热循环环境下加速测试的可靠性评估方法，以评估具有多种故障模式的电子设备的可靠性。首先，分析了热环境中电子设备的两种典型故障模式。结论是，很难通过现有的加速测试方法来评估复杂的电子设备（具有两种典型的故障模式）的可靠性。其次，通过将Arrhenius模型与Norris-Landzberg模型相结合来建立加速度模型。该模型考虑了热循环环境对两种典型故障的影响。第三，制定了热循环测试计划，并提出了一种新的方法来评估具有多种故障模式的电子设备的可靠性。最后通过算例说明了该方法的可行性，计算结果表明了该方法的有效性。

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