PURPOSE: A system and method for an improved thermal cycling test for evaluating the reliability of a stack package are provided to implement an accelerated life test on the stack package. CONSTITUTION: A system for an improved thermal cycling test for evaluating the reliability of a stack package includes a chamber (100), a cooling system (200), a stack package dummy specimen (300), and multiple stack package test specimens (400). Temperature inside the chamber is periodically and repetitively varied by preheated or precooled air. The cooling system inside the chamber is fed with extra power, and is independently operated in a hot or cold environment. The stack package dummy specimen for sensing the temperature is installed at the upper side of the cooling system. The stack package test specimens at the upper side of the cooling system simultaneously implement the improved cycling test.
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