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Experimental and Simulation Board Level Reliability Assessment of Wafer Level Chip Scale Packages (WCSPs) Under Thermal Cycling

机译：热循环下晶圆级芯片级封装（WCSP）的实验和仿真板级可靠性评估

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作者
Khan, Hassaan Ahmad;
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作者单位

The University of Texas at Arlington;

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授予单位 The University of Texas at Arlington;
学科
学位 M.S.
年度 2015
页码 55 p.
总页数 55
原文格式 PDF
正文语种 eng
中图分类
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1. Structural design optimization for board-level drop reliability of wafer-level chip-scale packages [J] . Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Microelectronics reliability . 2008,第5期

机译：晶圆级芯片级封装的板级跌落可靠性的结构设计优化
2. Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages [J] . Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang Journal of Electronic Packaging . 2007,第1期

机译：晶圆级芯片级封装的板级跌落可靠性研究
3. Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages [J] . Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang Journal of Electronic Packaging . 2007,第1期

机译：晶圆级芯片级封装的板级跌落可靠性研究
4. Experimental and Numerical Assessment of Board-Level Temperature Cycling Performance for Eutectic and Pb-free windows-Chip-Scale-Package (wCSP) [C] . Wei Sun, Zhu, W.H., . 2006

机译：共晶和无铅窗口-芯片级封装（wCSP）的板级温度循环性能的实验和数值评估
5. Fabrication of CZTS solar cells by sputtering method An experimental technique to measure the resistance change of ITO thin film during cyclic bending Reliability study of wafer level chip scale package using board level drop test. [D] . Ramesh, Dasharathy N. 2013

机译：溅射法制备CZTS太阳能电池循环弯曲过程中测量ITO薄膜电阻变化的实验技术使用板级跌落试验研究晶圆级芯片规模封装的可靠性。
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. Development of Resin Strress Buffer Layer Type Wafer Level Chip Size Package with High Reliability for Board Level Test [O] . Nobuaki HASHIMOTO, Shuichi TANAKA, Shunpei OGAYA, 2008

机译：开发树脂应力缓冲层型晶片型芯片尺寸封装，具有高可靠性的板级测试

Experimental and Simulation Board Level Reliability Assessment of Wafer Level Chip Scale Packages (WCSPs) Under Thermal Cycling

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