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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly
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Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly

机译：板级级堆叠堆叠组件的功率和热循环耦合可靠性

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摘要

In this paper, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level package-on-package (PoP) stacking assembly under coupled power and thermal cycling test conditions. Effects of powering sequences on thermal characteristics and fatigue reliability of the PoP are examined. The numerical analysis shows that coupled power and thermal cycling creates temperature excursions based on the thermal cycling profile. Also, reliability of the PoP is highly related to the range of temperature excursions and the degree of deviation of the temperature profile from the thermal cycling profile.
机译：在本文中，进行了顺序热力耦合分析，依次分析了瞬态温度场和随后的热机械变形，以研究板级层叠封装（PoP）堆叠组件的热特性以及疲劳可靠性在功率和热循环耦合测试条件下。检查了供电顺序对PoP的热特性和疲劳可靠性的影响。数值分析表明，功率和热循环耦合会基于热循环曲线产生温度偏移。而且，PoP的可靠性与温度偏移范围以及温度曲线与热循环曲线的偏离程度高度相关。

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