首页> 外文会议>Electronics Packaging Technology Conference >Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests

【24h】

Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests

机译：封装堆叠组件的板级可靠性经过耦合电源和热循环试验

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

In this work, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level package-on-package (PoP) stacking assembly under coupled power and thermal cycling test conditions. Effects of powering sequences on thermal characteristics and fatigue reliability of the PoP are examined.

机译：在这项工作中，进行顺序热机械耦合分析，其解决瞬态温度场和随后的热机械变形，以研究热特性以及板级封装（POP）堆叠组件的疲劳可靠性在耦合电源和热循环试验条件下。检查了POP对热特性和疲劳可靠性的动力序列的影响。

著录项

来源
《Electronics Packaging Technology Conference》|2007年||共6页
会议地点
作者
Tong Hong Wang; Yi-Shao Lai; Chang-Chi Lee; Ching-Chun Wang;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类 TN405.94-53;
关键词

相似文献

外文文献
中文文献
专利

1. Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly [J] . Wang T. H., Lai Y.-S., Lee C.-C., IEEE transactions on electronics packaging manufacturing . 2009,第1期

机译：板级级堆叠堆叠组件的功率和热循环耦合可靠性
2. Thermal Characteristics and Thermomechanical Reliability of Board-Level Stacked-Die Packages Subjected to Coupled Power and Thermal Cycling Test [J] . Wang T. H., Lee C.-C., Lai Y.-S., IEEE Transactions on Components and Packaging Technologies . 2008,第2期

机译：经受功率耦合和热循环测试的板级叠层芯片封装的热特性和热机械可靠性
3. Examination of board-level drop reliability of package-on-package stacking assemblies of different structural configurations [J] . Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang Microelectronic Engineering . 2007,第1期

机译：检验不同结构配置的堆叠式堆叠堆叠组件的板级跌落可靠性
4. Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests [C] . Tong Hong Wang, Yi-Shao Lai, Chang-Chi Lee, Electronics Packaging Technology Conference . 2007

机译：封装堆叠组件的板级可靠性经过耦合电源和热循环试验
5. In-process stress analysis of flip chip assembly and reliability assessment during environmental and power cycling tests. [D] . Zhang, Jian. 2003

机译：在环境和电源循环测试期间进行倒装芯片组装的过程应力分析和可靠性评估。
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环试验中超薄芯片堆叠式3D-IC组件微型泵可靠性的影响
8. Assembly reliability of CSPs with various chiip sizes by accelerated thermal and mechanical cycling test [R] . Ghaffarian, R. 2000

机译：通过加速热和机械循环测试，具有各种chiip尺寸的Csp的装配可靠性

Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests

摘要

著录项

相似文献

相关主题

期刊订阅