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首页> 外文期刊>The Electrochemical Society interface >R1 - WIDE BANDGAP SEMICONDUCTORS FOR PHOTONIC AND ELECTRONIC DEVICES AND SENSORS III
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R1 - WIDE BANDGAP SEMICONDUCTORS FOR PHOTONIC AND ELECTRONIC DEVICES AND SENSORS III

机译:R1-用于光电子设备和传感器的宽带隙半导体

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Numerous applications are appearing for wide bandgap semiconductors, including blue/UV light emitters, high temperature/high power electronics, passivation layers for other semiconductors, and various types of sensors. The purpose of this symposium is to bring together the crystal growth, device processing, circuit design and applications communities to discuss basic science and technology issues related to utilization of III-nitride based semiconductors. Papers are solicited in the following areas: 1. Substrates and bulk growth; 2. Epitaxial growth, especially for highly-doped layers; 3. High growth-rate methods; 4. Wet and dry etching techniques; 5. Ion implantation and diffusion; 6. Contact technology; 7. Fundamental optical, physical, and electrical properties; 8. Materials and device characterization; 9. Harsh environment sensors, chemical and gas sensors, and other novel applications for wide gap materials; and 10. Reliability issues. The program will consist of both invited and contributed papers.Publication of a joint Proceedings Volume with the symposium on State-of-the-Art Program on Compound Semiconductors XXXVI is planned to be available at the Meeting. A typed camera ready copy of the full proceedings volume manuscript and a list of key words is required by January 1,2002. Instructions for preparing the manuscript will be sent out by the Symposium Organizers after acceptance of abstracts.
机译:宽带隙半导体的应用越来越广泛,包括蓝/紫外光发射器,高温/高功率电子器件,其他半导体的钝化层以及各种类型的传感器。本次研讨会的目的是召集晶体生长,器件加工,电路设计和应用社区,讨论与利用基于III族氮化物的半导体有关的基础科学和技术问题。征集论文涉及以下几个方面:1.底材和体积增长; 2.外延生长,特别是对于高掺杂层; 3.高增长率方法; 4.湿法和干法蚀刻技术; 5.离子注入和扩散; 6.接触技术; 7.基本的光学,物理和电气特性; 8.材料和器件表征; 9.恶劣环境传感器,化学和气体传感器,以及其他适用于宽间隙材料的新颖应用; 10.可靠性问题。该计划将包括受邀论文和投稿论文。计划在本次会议上出版联合论文集和有关化合物半导体XXXVI的最新计划的专题讨论会。要求在2002年1月1日之前提供完整的诉讼程序手稿的打字本,可随时复印。论文摘要接受后,研讨会组织者将发出准备手稿的说明。

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